电镀条件对CoP非晶镀层催化活性的影响

发布时间：2018-01-28 19:45

  本文关键词： CoP 电镀 硼氢化钠 制氢 正交试验　出处：《表面技术》2017年10期 　论文类型：期刊论文

【摘要】：目的考察电镀条件对CoP镀层催化硼氢化钠水解产氢性能的影响规律。方法通过电镀法在铜片表面沉积CoP非晶催化剂,并用于催化硼氢化钠水解制氢。催化剂微观形貌和元素组成分别由场发射扫描电子显微镜(FE-SEM)和能谱仪(EDS)进行表征。通过正交试验确定沉积时间、沉积温度、电流密度对催化剂活性的影响等级。同时,考察了NaBH4浓度、反应温度和循环使用对催化剂性能的影响。结果 FE-SEM和EDS分析表明,CoP镀层由直径200nm左右的晶粒堆积而成,Co与P的原子比为3.6:1。正交实验结果表明,沉积时间对催化剂活性的影响程度最大,之后依次为沉积温度和电流密度。当沉积温度、时间、电流密度分别为20℃、1min、5.56A/dm~2时,所制备的催化剂活性最高。30℃下,6%NaBH_4+2%NaOH体系中,氢气的生成速率为2750mL/(min·g),反应表观活化能为41.2kJ/mol,循环使用4次后,催化剂活性降低64%。结论采用电镀法成功制备了CoP/Cu催化剂,其催化硼氢化钠水解产氢性能优异。电镀条件中,沉积时间是影响催化剂活性的首要因素,其次为沉积温度和电流密度。
[Abstract]:Objective to investigate the effect of electroplating conditions on the catalytic properties of CoP coating for hydrogen production by hydrolysis of sodium borohydride. Methods CoP amorphous catalyst was deposited on the surface of copper by electroplating. It was also used to catalyze the hydrolysis of sodium borohydride to produce hydrogen. The microstructure and elemental composition of the catalyst were characterized by field emission scanning electron microscopy (FE-SEM) and energy dispersive spectrometer (EDS), respectively. The deposition time was determined by orthogonal test. The influence of deposition temperature and current density on the activity of the catalyst was investigated. Meanwhile, the concentration of NaBH4 was investigated. Results FE-SEM and EDS analysis showed that the coating was composed of 200 nm diameter grains. The atomic ratio of Co to P is 3.6: 1. The results of orthogonal experiment show that the influence of deposition time on catalyst activity is the greatest, followed by deposition temperature and current density. The current density is 20 鈩，

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