电子线路的微孔金属化在电镀铜工艺中的应用

发布时间：2018-04-18 04:37

本文选题：电子线路 + 微孔金属化　；参考：《科技通报》2017年09期

【摘要】：电镀铜残留的添加剂会导致铜在退火过程中很难产生大金属颗粒,造成孔洞缺陷。为此,将电子线路的微孔金属化技术应用于电镀铜工艺中,分析了电镀铜工艺的原理。介绍了电镀铜工艺中的重要阶段,包括电镀液与化学添加剂的选择阶段和退火阶段。分析了电子线路微孔金属化的实现过程,包括除油和整孔、微蚀、浸酸和预浸、活化和加速以及电镀锌。通过电子线路的微孔金属化对电镀铜工艺中的孔洞缺陷进行修复,以增加电镀铜的导电性能。实验结果表明,将电子线路的微孔金属化应用于电镀铜工艺后,电镀铜外观明显变得光滑且带有金属光泽,且镀层导电能力大大增强,说明电子线路的微孔金属化能够有效解决电镀铜工艺中的孔洞缺陷问题。
[Abstract]:The residual additives of electroplating copper will make it difficult for copper to produce large metal particles during annealing, resulting in hole defects.For this reason, the microporous metallization technology of electronic circuit is applied to electroplating copper process, and the principle of electroplating copper process is analyzed.This paper introduces the important stages of copper electroplating process, including the selection stage and annealing stage of electroplating solution and chemical additives.The realization process of micropore metallization in electronic circuit was analyzed, including oil removal and whole hole removal, micro-etching, acid leaching and prepreg, activation and acceleration, and zinc plating.In order to improve the electrical conductivity of copper electroplating, the defects of holes in electroplating process were repaired by microcellular metallization of electronic circuit.The experimental results show that the appearance of the electroplated copper becomes smooth and has metallic gloss, and the electric conductivity of the coating is greatly enhanced when the microporous metallization of the electronic circuit is applied to the electroplating process.The results show that the microporous metallization of electronic circuit can effectively solve the hole defect in copper electroplating process.
【作者单位】：中山市技师学院电气应用系;
【分类号】：TQ153.14

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