300mm硅片高精度真空传输系统设计

发布时间：2018-05-02 15:21

  本文选题：硅片传输 + 真空腔室　； 参考：《组合机床与自动化加工技术》2017年08期

【摘要】：文章设计一种300mm硅片真空传输系统,满足市场对硅片传输过程高精度,高洁净度,高效率的需求。其中硅片传输腔室采用真空设计,并优化了真空腔室的结构以适应300mm硅片传输,真空度可达2×10~(-7)Torr。真空机械手采用对称连杆直驱机械手,大气机械手采用R-θ型机械手,其重复精度均为±0.1mm。设计了AWC纠偏检测系统,利用光电对射传感器,实现对硅片的实时检测及位置纠正。通过验证性试验数据分析,得到整个系统的整体精度、洁净度、真空度和真空变化值满足工作要求,验证了设计的合理性。
[Abstract]:In this paper, a 300mm wafer vacuum transmission system is designed to meet the market demand for high precision, high cleanliness and high efficiency in wafer transmission process. The silicon wafer transfer chamber is designed by vacuum, and the structure of the vacuum chamber is optimized to fit the 300mm wafer transmission. The vacuum degree can reach 2 脳 10 ~ (-1) -7 脳 10 ~ (-1) Torr. The vacuum manipulator adopts symmetrical connecting rod direct drive manipulator, and the atmospheric manipulator adopts R- 胃 type manipulator. The repetition accuracy of vacuum manipulator is 卤0.1mm. A AWC detecting system is designed to detect and correct the position of silicon wafer in real time by using optoelectronic emitter sensor. Through the analysis of the verification test data, the overall accuracy, cleanliness, vacuum and vacuum variation values of the whole system are obtained, and the rationality of the design is verified.
【作者单位】： 沈阳新松机器人自动化股份有限公司;
【基金】：国家科技重大专项02专项(2014ZX02103005)
【分类号】：TQ127.2
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本文编号：1834451