低介电硼、铌酸盐玻璃性能的研究

发布时间：2018-06-08 16:17

本文选题：低介电玻璃 + 高硼含量　；参考：《海南大学》2015年硕士论文

【摘要】：低介电玻璃是一种非常重要、广泛应用的电性能材料,它具有较低的电容率(介电常数)或介电损耗,良好的热性能和化学稳定性,优良的机械性能,主要用于制造电容器和电器回路元件的支撑层。与有机介电材料相比,介电玻璃的热膨胀系数更小、抗老化性能更佳、能承受更高的温度,因此被广泛应用于集成电路、移动通信、卫星通信等光通讯与光电子材料领域中。然而目前集成电路的集成度日益提高,射频连接器、微波器件等工作频率范围也大幅增加,传统单一的硅酸盐低介电玻璃已不能满足发展需求,因此开发新型低介电玻璃成为了研究热点。本论文在前人的研究基础之上,设计了三种玻璃体系：高硼硅酸盐玻璃体系,往玻璃中加入超高含量(50%摩尔比)的氧化硼；稀土金属氧化物Ta205掺杂铌酸盐玻璃体系,用Ta205替代玻璃中Nb205；混合玻璃体系,将上述两种玻璃粉末按一定比例混合烧结。分别深入系统的研究了三种玻璃体系的热性能、介电性能的变化规律,以及玻璃内部各基团的相互作用和转化影响,取得如下结果：高硼含量硅酸盐玻璃体系：通过差热分析发现高硼硅酸盐玻璃难以析晶,主要是因为B203为玻璃网络形成体,破坏其价键结合而析晶需要很大的能量；从红外光谱分析表明,当过量的B203加入玻璃中,[BΩ3]、[BＯ4]的数量都急剧增加,而[B03]是主要形成体；随着B203含量的增加,玻璃的介电常数与介电损耗都呈现先减小后增大的趋势,室温1MHz下,B203为80%mol介电常数可达到最小值5.19；B203为60%mol介电损耗可以降低到3.584×10-。实验结果表明过量的B203并不能一直起到降低介电常数与介电损耗的作用。玻璃的热膨胀系数随着B203的加入出现了S型变化,可能是[BＯ3],[BＯ4]以及硼反常共同作用的结果。超高硼含量的硼硅酸盐玻璃转变温度、软化温度和高温黏度都随着B203含量的增加而降低,但对高温黏度的影响作用有限。钽-酸盐玻璃体系：通过红外图谱发现Ta205不参与玻璃网络结构的形成,以修饰体的形式存在于网络外,且会降低玻璃网络的规整度。差热结果表明,原先的铌酸盐玻璃只有一个较宽的析晶峰,加入氧化钽后,该宽峰分为两个独立的窄峰,分峰效果明显。XRD分析结果可知,低温晶相主要有NaTaＯ3, Na2Ta6Si2Ｏ1５；高温晶相则包括NaTaＯ3、 Ba2NaTa5Ｏ15、 BaNb3.6O10四种晶体。SEM图谱显示高温晶相的晶粒尺寸普遍都大于低温晶相。Ta205一定范围内可降低铌酸盐玻璃的介电常数与介电损耗,但降低能力有限,在3%mol的Ta205加入量时玻璃的介电常数与介电损耗达到最低,分别为10.67和3.63×10-3。析晶后的玻璃样品介电常数与介电损耗都有所增加,其中高温晶相的介电常数、介电损耗都要高于低温晶相。玻璃的转变温度与膨胀软化温度都随着Ta205的加入逐步增加。热膨胀系数呈现N型变化,因为Ta5+对玻璃网络结构有一定的破坏,非桥氧大量生成又导致网络体外的大量修饰体形成,两种过程相互影响牵制。混合玻璃体系：通过介电性能的测试,混合玻璃的介电常数相比于单独两种玻璃体系得到大幅下降,最低达到4.18,这是因为玻璃内部空隙的形成所导致的；而介电损耗却增加了一个数量级。
[Abstract]:Compared with the organic dielectric material , the dielectric glass has the advantages of smaller thermal expansion coefficient , better anti - aging performance and higher temperature , and is widely applied to the fields of optical communication and optoelectronic materials such as integrated circuit , mobile communication , satellite communication and the like .

Based on the previous research , three kinds of glass systems were designed : high borosilicate glass system , high content ( 50 % mole ratio ) boron oxide added to glass ;
the rare earth metal oxide Ta205 is doped with a niobate glass system , and the Nb205 in the glass is replaced by Ta205 ;
The thermal properties and dielectric properties of three kinds of glass systems and the influence of the interaction and conversion of various groups inside the glass are studied . The results are as follows :

High boron content silicate glass system : It is found that high borosilicate glass is difficult to be crystallized by differential thermal analysis , mainly because B203 is a glass network formed body , destroys its valence bond , and the crystallization requires a large amount of energy ;
The results show that when the excess B203 is added to the glass , the number of B .
With the increase of B203 content , the dielectric constant and dielectric loss of glass exhibit a tendency to decrease first , and at room temperature 1MHz , B203 has a dielectric constant of 80 % and can reach a minimum value of 5.19 ;
The dielectric loss of B203 can be reduced to 3.584.times . 10 - . The experimental results show that the excess B203 does not always play a role in reducing dielectric constant and dielectric loss . The thermal expansion coefficient of glass decreases with the addition of B203 . The transition temperature , softening temperature and high temperature viscosity of borosilicate glass with ultra - high boron content decrease with the increase of B203 content , but the effect on high temperature viscosity is limited .

The results show that the low temperature crystalline phase is mainly NaTaO3 , Na2Ta6Si2O15 .
The dielectric constant and dielectric loss of the glass are all higher than that of the low - temperature crystalline phase . The dielectric constant and dielectric loss of the glass are all higher than that of the low - temperature crystalline phase . The dielectric constant and dielectric loss of the glass are all higher than that of the low - temperature crystalline phase .

mixed glass system : the dielectric constant of the mixed glass is greatly reduced compared to the single two glass systems by the testing of the dielectric properties , and the lowest reaches 4.18 because of the formation of voids in the glass ;
while dielectric loss increases by an order of magnitude .
【学位授予单位】：海南大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TQ171.7

【参考文献】