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B270玻璃-TC4钛合金热压阳极键合连接工艺研究

发布时间:2018-07-16 16:32
【摘要】:采用了热压-阳极键合复合连接工艺对B270玻璃/TC4钛合金进行连接,分析了真空热压参数对B270玻璃/TC4钛合金连接界面结构、结合效果的影响,并研究了B270玻璃/TC4钛合金的阳极键合工艺,分析了不同键合工艺参数下的工艺特征。结果表明,当对应的真空热压参数为:T=750℃,t=2 h,P=0.5 MPa,当键合温度T在350~550℃,电场电压V在500~700 V时,有最佳的连接效果。键合界面结构分析发现,整个键合区域是由玻璃-中间过渡层-TC4钛合金的结构组成,界面两侧的化学元素呈梯度分布。
[Abstract]:B270 glass / TC4 titanium alloy was bonded by hot pressing and anodic bonding process. The effect of vacuum hot pressing parameters on the interface structure and bonding effect of B270 glass / TC4 titanium alloy was analyzed. The anodic bonding process of B270 glass / TC4 titanium alloy was studied, and the process characteristics of B270 glass / TC4 titanium alloy under different bonding parameters were analyzed. The results show that the optimal bonding effect is obtained when the corresponding vacuum hot pressing parameters are as follows: 1: TX 750 鈩,

本文编号:2126968

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