硅片总厚度偏差及翘曲度检测装置研制与测试
发布时间：2018-10-15 14:35
【摘要】：通过机械结构、控制系统及显示系统设计,研制了硅片总厚度偏差及翘曲度检测装置,该装置具备自动送料、自动检测、自动回料、自动显示与数据存储等功能;设计相关实验条件,对装置进行了测试,并根据测试结果分析了其测量不确定度;将装置与Mahr测长仪进行了比较测量,试验表明,该装置精度满足设计要求,且性能稳定。
[Abstract]:Through the design of mechanical structure, control system and display system, a device for detecting the total thickness deviation and warpage of silicon wafer is developed. The device has the functions of automatic feeding, automatic detection, automatic material return, automatic display and data storage. The relative experimental conditions were designed and the measurement uncertainty was analyzed according to the test results. The experimental results show that the accuracy of the device meets the design requirements and the performance of the device is stable.
【作者单位】： 浙江机电职业技术学院;台州市计量技术研究院;湖州出入境检验检疫局;
【基金】：浙江省质量技术监督系统科研项目(20130294)
【分类号】：TQ056;TQ127.2
本文编号：2272855
[Abstract]:Through the design of mechanical structure, control system and display system, a device for detecting the total thickness deviation and warpage of silicon wafer is developed. The device has the functions of automatic feeding, automatic detection, automatic material return, automatic display and data storage. The relative experimental conditions were designed and the measurement uncertainty was analyzed according to the test results. The experimental results show that the accuracy of the device meets the design requirements and the performance of the device is stable.
【作者单位】： 浙江机电职业技术学院;台州市计量技术研究院;湖州出入境检验检疫局;
【基金】：浙江省质量技术监督系统科研项目(20130294)
【分类号】：TQ056;TQ127.2
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