高密封装用BGA焊球制备工艺研究

发布时间：2018-01-15 17:24

  本文关键词：高密封装用BGA焊球制备工艺研究　出处：《河南科技大学》2017年硕士论文　论文类型：学位论文

  更多相关文章： BGA焊球 切丝重熔法 工艺参数 真球度 表面质量 含氧量

【摘要】：电子信息产品的迅猛发展使得集成电路封装快速向高密度、智能化模式发展。球栅阵列(Ball Grid Array,BGA)封装技术的诞生使得电子产品具有更高的可靠性和更好的散热性及电学性能等,成为目前使用最普遍的封装技术。锡球是BGA封装技术的关键材料,锡球质量决定着封装质量,因此研究锡球的生产工艺具有重要意义。本文利用切丝重熔法制备BGA焊球,通过设定不同球化工艺参数研究了球化温度、球化介质和球化区间分别对BGA焊球真球度、表面质量和含氧量的影响,以及相同工艺参数下不同钎料BGA焊球的质量。研究结果表明:BGA焊球真球度随球化温度升高先增大后减小,表面质量先变优后变差,含氧量逐渐升高,300℃时钎焊球真球度最高,为97.73%,含氧量为0.009wt%,且表面平整度与光洁度高,无明显缺陷,表面质量最优,为最优制球温度。以花生油为球化介质的BGA焊球真球度最高,氧化程度最低,表面质量最优,球化效果最好;蓖麻油球化效果次之,钎焊球真球度为97.28%,表面略显粗糙,含氧量为0.028wt%;机油球化效果较差,钎焊球真球度为96.85%,表面质量差,氧化程度大;硅油球化效果最差,钎焊球真球度仅为88.67%,且表面质量差,含氧量高。BGA焊球真球度随球化区间的增加呈增大趋势,表面质量先变优后变差,含氧量逐渐升高。球化区间为600mm和700mm时,焊球真球度分别为97.73%和97.85%,含氧量分别为0.009wt%和0.0093wt%,且两者表面质量较好,球化区间为800mm时,钎焊球真球度较高,为97.87%,但表面质量稍差,含氧量较高,综合考虑,球化区间为600-700mm时球化效果最佳。相同工艺条件下,Sn3Ag0.5Cu焊球真球度为98.2%,含氧量为0.015wt%,钎焊球表面略显粗糙;Sn0.7Cu焊球真球度为97.86%,含氧量为0.026wt%,钎焊球表面存在有少量凸瘤,且表面粗糙,局部区域有不同程度的氧化现象,表面质量较差;63Sn37Pb焊球真球度为97.73%,含氧量为0.009wt%,焊球表面光滑平整无明显缺陷,表面质量较好。
[Abstract]:With the rapid development of electronic information products, integrated circuit packaging is rapidly developing to high density and intelligent mode. Ball Grid Array. Due to the birth of BGA packaging technology, electronic products have higher reliability, better thermal and electrical properties, and become the most popular packaging technology. Tin ball is the key material of BGA packaging technology. The quality of tin ball determines the packaging quality, so it is of great significance to study the production process of tin ball. In this paper, BGA solder balls are prepared by wire cutting remelting method, and the spheroidizing temperature is studied by setting different spheroidizing process parameters. The effects of spheroidizing medium and spheroidizing interval on the true sphericity, surface quality and oxygen content of BGA solder balls were investigated. The results show that the true sphericity of the BGA solder ball increases firstly and then decreases with the increase of spheroidizing temperature, and the surface quality first improves and then becomes worse, and the oxygen content increases gradually. At 300 鈩，

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