多场耦合时效对微焊点界面组织与性能的影响

发布时间：2018-06-04 04:04

本文选题：多场耦合 + 高温时效　；参考：《金属热处理》2017年03期

【摘要】：模拟复杂环境中的热场、电场、磁场和力场四维场合,设计制作了多场耦合时效装置,研究了Cu/Sn58Bi-0.05Sm/Cu微焊点在25、50、100和200 h的多场耦合时效过程中,界面金属间化合物的微观组织变化和力学行为。结果表明:随着时效时间的延长,焊点热端(阳极)的IMC层平整饱满,逐渐变厚,而冷端(阴极)呈现锯齿形,逐步变薄,出现大量的空位和空洞,并形成裂纹;焊点抗拉强度呈抛物线型下降,时效初期抗拉强度降速较大,之后降速逐渐减缓;拉伸断口逐步呈现小裂纹→单一大裂纹→多条大裂纹的现象,断裂机理为解理断裂,焊点的可靠性不断降低。
[Abstract]:In this paper, the coupling aging device of multi-field is designed and fabricated in the four-dimensional field of thermal field, electric field, magnetic field and force field in complex environment. The coupling aging process of Cu/Sn58Bi-0.05Sm/Cu micro-solder joint at 2550100 h and 200h is studied. Microstructure and mechanical behavior of intermetallic compounds. The results show that with the aging time prolonging, the IMC layer of the hot end of solder joint (anode) becomes smooth and full, and gradually thickened, while the cold end (cathode) presents sawtooth shape, gradually thinning, a large number of vacancies and voids, and the formation of cracks. The tensile strength of solder joint decreases in parabola shape, the tensile strength decreases faster at the early aging stage, then slows down gradually, and the tensile fracture surface gradually presents the phenomenon of single large crack with multiple large cracks, and the fracture mechanism is cleavage fracture. The reliability of solder joint is decreasing.
【作者单位】：徐州生物工程职业技术学院机电工程系徐州市绿色洁净复合钎料工程技术研究中心;徐州工程学院江苏省大型工程装备检测与控制重点建设实验室;
【基金】：国家自然科学基金青年项目(51505040) 江苏省第五期“333工程”第三层次培养资金资助项目江苏省高等学校大学生创新创业训练计划项目(201614401007X) 徐州市科技计划项目(KC15SM041) 校科技计划项目(2015KY02) 徐州工程学院培育项目(XKY2016118) 江苏省大型工程装备检测与控制重点建设实验室开放课题(JSKLEDC201510)
【分类号】：TG156.92;TG40

【相似文献】