一种功率器件封装钎料的设计及性能分析
发布时间：2018-10-22 18:49
【摘要】：随着电子产品的不断更新换代,第三代半导体开始被广泛应用在高温电子封装中,为此急需开发耐高温高强度的新型锡基钎料。本文的主要研究内容分为两个方面:一是Sn-Sb基无铅钎料成分的设计。采用正交设计试验选出最佳的Sn-Sb基合金成分。同时分析了 SnSbCuNiAg/Cu焊接性及焊接工艺。二是纳米铜颗粒对锡基无铅钎料的改性方法研究,为进一步提高Sn-Sb基合金的综合性能提供理论依据。通过大量的试验,研究了合金元素对Sn-Sb基钎料熔化特性的影响。以熔化温度、润湿性以及导热率为评价指标,对Sn-Sb基钎料成分进行初选和优选。Sn-Sb合金中添加不同含量的Ag、Cu、Ni元素以及高熔点的中间合金,其熔化温度均在221-242 ℃范围内。采用正交设计试验,优选出三种Sn-Sb 基钎料分别为 Sn-5Sb-0.5Cu-0.1Ni-0.1Ag、Sn-5Sb-1Cu-0.1Ni-0.1Ag 和Sn-5Sb-0.5Cu-0.1Ni-0.5Ag。分析了三种SnSbCuNiAg/Cu焊点的微观组织及力学性能。280 ℃C钎焊10 s至90s时,焊点界面IMC层不断增厚。当Cu和Ag含量的增加,界面IMC的生长指数有所改变。在280 ℃钎焊30 s时,三种焊点的剪切强度均达到最大。其中Sn-5Sb-0.5Cu-0.1Ni-0.5Ag的剪切强度最高,比SAC305的强度高 36.4^。280 ℃钎焊 10 s 至 90 s 时,Sn-5Sb-0.5Cu-0.1Ni-0.1Ag/Cu焊点的断裂方式由韧性断裂逐渐过渡为韧脆混合断裂。三种Sn-Sb基钎料的硬度均高于SAC305。为细化钎料的微观组织,进一步提高焊点的力学性能,研究了纳米铜颗粒对锡基焊膏的改性方法。添加0.1-1.0 wt%的纳米Cu颗粒对钎料的熔点影响不大。纳米Cu颗粒的添加细化了体钎料的微观组织。热时效前后,添加0.1-1.0wt%的纳米Cu颗粒抑制了界面IMC的生长。当添加1.0wt%纳米Cu颗粒后,界面IMC的晶粒尺寸有所增加。纳米Cu颗粒的添加使焊点体钎料的显微硬度提高。然而焊点中的气孔对焊点硬度和剪切强度产生不利影响。分析了气孔的形成机理。同时研究了纳米Cu含量对气孔率的影响,随纳米Cu含量从0.1 wt%增至1.0 wt%,气孔率增大。
[Abstract]:With the continuous upgrading of electronic products, the third generation semiconductor has been widely used in high temperature electronic packaging. Therefore, it is urgent to develop new solders with high temperature resistance and high strength. The main content of this paper is divided into two aspects: one is the design of Sn-Sb-based lead-free solder composition. The optimum composition of Sn-Sb base alloy was selected by orthogonal design test. At the same time, the weldability and welding process of SnSbCuNiAg/Cu are analyzed. Secondly, the modification method of tin based lead-free solder by nano-copper particles is studied, which provides a theoretical basis for further improving the comprehensive properties of Sn-Sb based alloys. The effect of alloying elements on the melting characteristics of Sn-Sb based solder was studied by a large number of experiments. With melting temperature, wettability and thermal conductivity as evaluation indexes, the composition of Sn-Sb based solder was selected and selected. The melting temperature of Sn-Sb alloy with different content of Ag,Cu,Ni elements and high melting point master alloy was in the range of 221-242 鈩，
本文编号：2288008
[Abstract]:With the continuous upgrading of electronic products, the third generation semiconductor has been widely used in high temperature electronic packaging. Therefore, it is urgent to develop new solders with high temperature resistance and high strength. The main content of this paper is divided into two aspects: one is the design of Sn-Sb-based lead-free solder composition. The optimum composition of Sn-Sb base alloy was selected by orthogonal design test. At the same time, the weldability and welding process of SnSbCuNiAg/Cu are analyzed. Secondly, the modification method of tin based lead-free solder by nano-copper particles is studied, which provides a theoretical basis for further improving the comprehensive properties of Sn-Sb based alloys. The effect of alloying elements on the melting characteristics of Sn-Sb based solder was studied by a large number of experiments. With melting temperature, wettability and thermal conductivity as evaluation indexes, the composition of Sn-Sb based solder was selected and selected. The melting temperature of Sn-Sb alloy with different content of Ag,Cu,Ni elements and high melting point master alloy was in the range of 221-242 鈩，
本文编号：2288008
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