焊后退火Al-Mg界面金属间化合物生长行为
发布时间：2018-10-25 19:26
【摘要】：研究了6061Al铝合金和AZ31B镁合金的搅拌摩擦搭接焊(FSLW)接头微观组织及焊后热处理过程中接头界面金属间化合物(IMC)生长行为.结果表明,在接头界面处,金属间化合物层由连续的β-Al_3Mg_2(靠近铝侧)相和γ-Al_(12)Mg_(17)靠近镁侧)相组成.IMC层的厚度随着时间延长或者温度的提高而增加,并且β-Al_3Mg_2相生长快于γ-Al12Mg17相.整个IMC层的生长厚度与退火时间的平方根成线性关系,其生长受扩散机制影响.随着温度从300℃增加到400℃,IMC层生长的扩散系数从2.88×10~(-14)m~2/s增加到3.67×10~(-13)m~2/s.界面IMC层的生长激活能为82.5 kJ/mol.
[Abstract]:The microstructure of 6061Al aluminum alloy and AZ31B magnesium alloy in friction stir lap welding (FSLW) joint and the growth behavior of intermetallic compound (IMC) at the interface of (FSLW) joint during post-weld heat treatment were studied. The results show that, at the interface of the joint, The intermetallic compound layer is composed of continuous 尾-Al_3Mg_2 (near the aluminum side) phase and 纬-Al_ (12) Mg_ (17) near the magnesium side. The thickness of the IMC layer increases with the increase of time or temperature. 尾-Al_3Mg_2 phase grew faster than 纬-Al12Mg17 phase. The growth thickness of the whole IMC layer is linearly related to the square root of annealing time, and its growth is affected by the diffusion mechanism. With the increase of temperature from 300 鈩，
本文编号：2294605
[Abstract]:The microstructure of 6061Al aluminum alloy and AZ31B magnesium alloy in friction stir lap welding (FSLW) joint and the growth behavior of intermetallic compound (IMC) at the interface of (FSLW) joint during post-weld heat treatment were studied. The results show that, at the interface of the joint, The intermetallic compound layer is composed of continuous 尾-Al_3Mg_2 (near the aluminum side) phase and 纬-Al_ (12) Mg_ (17) near the magnesium side. The thickness of the IMC layer increases with the increase of time or temperature. 尾-Al_3Mg_2 phase grew faster than 纬-Al12Mg17 phase. The growth thickness of the whole IMC layer is linearly related to the square root of annealing time, and its growth is affected by the diffusion mechanism. With the increase of temperature from 300 鈩，
本文编号：2294605
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