AgCuNiLi钎焊TiC金属陶瓷与GH3128界面结构及接头性能
发布时间：2018-11-24 13:05
【摘要】：采用AgCuNiLi钎料对TiC金属陶瓷与GH3128镍基高温合金进行钎焊。结果表明:当钎焊温度为840℃,保温10min时,接头典型界面结构可以表示为:TiC金属陶瓷/(Cu,Ni)/Ag(s.s)+Cu(s.s)/(Cu,Ni)/GH3128。随着钎焊温度的升高或保温时间的延长,TiC金属陶瓷附近的(Cu,Ni)固溶体层厚度增大,且向钎料内部呈树枝状长大,钎料内部的Ag-Cu共晶组织逐渐减少。界面机理分析表明:钎料中Li的加入能促进界面上(Cu,Ni)固溶体的形成;但(Cu,Ni)固溶体的继续长大则受钎料中Cu元素的扩散程度控制。当加热温度由810℃升高到960℃,接头抗剪强度呈现先增大,然后缓慢减小的变化趋势。当加热温度为880℃、保温时间为10min时,接头抗剪强度达到最大值204MPa。
[Abstract]:TiC cermet and GH3128 nickel base superalloy were brazed with AgCuNiLi filler metal. The results show that the typical interface structure can be expressed as TiC cermet / (Cu,Ni) / Ag (s.s) Cu (s.s) / (Cu,Ni) / GH3128. when brazing temperature is 840 鈩，
本文编号：2353829
[Abstract]:TiC cermet and GH3128 nickel base superalloy were brazed with AgCuNiLi filler metal. The results show that the typical interface structure can be expressed as TiC cermet / (Cu,Ni) / Ag (s.s) Cu (s.s) / (Cu,Ni) / GH3128. when brazing temperature is 840 鈩，
本文编号：2353829
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