高强高导Cu-Nb微观复合材料热稳定性
发布时间：2018-11-24 13:08
【摘要】：通过集束拉拔技术制备了高强高导Cu-Nb微观复合材料,采用X射线衍射和扫描电镜等手段分析了不同热处理条件下材料晶体取向和界面结构的演变,通过应力应变曲线和电导测试研究了不同热处理条件对材料强度和电导的影响规律,结果表明:700℃热处理就可促使形成Cu、Nb的再结晶织构,由极塑变形所导致的区域化学势差异及原子扩散是影响Cu/Nb界面稳定性的关键因素;而700℃的中间热处理可以极大改善材料后续的加工塑性,同时在一定后续形变量条件下仍可获得高强度性能,而且通过低温调整热处理可改善材料导电性,同时保持较高强度。
[Abstract]:High strength and high conductivity Cu-Nb microcomposites were prepared by cluster drawing technique. The evolution of crystal orientation and interface structure under different heat treatment conditions were analyzed by means of X-ray diffraction and scanning electron microscope. The effects of different heat treatment conditions on the strength and conductivity of Cu,Nb were studied by means of stress-strain curves and conductance measurements. The results showed that the recrystallization texture of Cu,Nb could be formed by heat treatment at 700 鈩，
本文编号：2353837
[Abstract]:High strength and high conductivity Cu-Nb microcomposites were prepared by cluster drawing technique. The evolution of crystal orientation and interface structure under different heat treatment conditions were analyzed by means of X-ray diffraction and scanning electron microscope. The effects of different heat treatment conditions on the strength and conductivity of Cu,Nb were studied by means of stress-strain curves and conductance measurements. The results showed that the recrystallization texture of Cu,Nb could be formed by heat treatment at 700 鈩，
本文编号：2353837
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