表面纳米化对铜镁合金电化学腐蚀行为的影响

发布时间：2018-12-07 14:54

【摘要】：为获得高强高导耐蚀铜合金接触线,以Conform态细晶铜镁合金(Cu-0.4%Mg(质量分数))为对象,研究高速旋转丝表面纳米化对其耐蚀性的影响。利用光学显微镜(OM)、透射电镜(TEM)、扫描电镜(SEM)分析试样的显微组织,并借助电化学工作站研究其电化学腐蚀行为。结果表明:伴随位错胞及孪晶的形成,铜镁合金表层晶粒细化至400 nm;表面纳米化后铜镁合金在NaOH溶液中会出现明显的活化-钝化-过钝化过程,其耐蚀性有所改善,腐蚀电流密度J_(corr)由5.347×10~(-5) A/cm~2减小至1.365×10~(-5) A/cm~2,自腐蚀电位φ_(corr)由-0.470 V提高至-0.415V。此外,提高OH 浓度会加剧腐蚀,但延长浸泡时间有利于钝化膜的形成,降低腐蚀速率。
[Abstract]:In order to obtain contact wire of high strength and high conductivity copper alloy, the effect of nanocrystalline surface on corrosion resistance of Conform fine grained copper magnesium alloy (Cu-0.4%Mg (mass fraction) was studied. The microstructure of the samples was analyzed by (OM), transmission electron microscope (TEM),) and scanning electron microscope (SEM). The electrochemical corrosion behavior of the samples was studied by electrochemical workstation. The results show that with the formation of dislocation cell and twin, the surface grain of Cu-mg alloy is refined to 400 nm;. The surface nanocrystalline copper magnesium alloy will have obvious activation-passivation-over-passivation process in NaOH solution, and its corrosion resistance will be improved. The corrosion current density J _ (corr) decreased from 5.347 脳 10 ~ (-5) A/cm~2 to 1.365 脳 10 ~ (-5) A / cm ~ (-2), and the corrosion potential 蠁 _ (corr) increased from -0.470 V to -0.415 V. In addition, increasing the concentration of OH increases the corrosion rate, but prolonging the immersion time is beneficial to the formation of passivation film and the decrease of corrosion rate.
【作者单位】：河海大学力学与材料学院;中铁建电气化局集团康远新材料有限公司;
【基金】：江苏省自然科学基金资助项目(BK20131373,BK20140856) 江苏省青蓝工程资助项目Project(BK20131373,BK20140856)~~
【分类号】：TG174.4

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