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疏水膜以及自组装膜对金属铜在海水中的防腐防污研究

发布时间:2019-01-03 13:18
【摘要】:铜具有优良的导电、导热性,机械性能和成形性,因此铜作为一种重要的金属已被广泛用于很多领域。然而,铜是一种化学性质活泼的金属,海水中不仅含有可以和金属铜发生配位反应的氯离子,还含有可以腐蚀铜的微生物,比如:大肠杆菌。因此研究金属铜在海水中的缓蚀很重要。本文主要采用表面修饰的方法,一种是利用含有氮原子的嘧啶分子4-苯基嘧啶(4-PPM)在表面形成自组装膜,用电化学阻抗、电化学极化曲线表征该自组装膜缓蚀性能,并运用相关的计算公式计算出不同方法所得到的缓蚀效率。通过密度泛函理论(DFT)计算了分子的最高分子占有轨道(HOMO)和最低分子未占有轨道(LUMO)以及偶极矩,最后利用拉曼光谱对分子在电极表面的吸附构型以及自组装膜的均一性进行检测。另外一种是基于聚多巴胺(PDA)的粘附性,在铜表面首先修饰具有粘性的聚多巴胺,接着修饰疏水性的十二烷基硫醇分子(1-DT),制得具有疏水性的表面。用接触角测量技术,近红外技术,以及X射线光电子能谱(XPS)等手段表征该疏水膜的成功制备。通过电子扫描显微镜(SEM)表明该疏水膜对铜在含有氯离子的海水中的较好的缓蚀能力。此外因为银纳米粒子有很好的抗菌性,因此在上述疏水膜的表面又引入了一定大小的银纳米粒子,用来延缓大肠杆菌对金属铜带来的腐蚀。用XPS等手段表征银纳米粒子的修饰成功,用SEM手段表明有银纳米粒子修饰的疏水膜有很好的抗菌性。1采用4-PPM分子作为自组装分子,研究了不同的组装时间和不同浓度的4-PPM溶液对铜缓蚀性能影响。当组装时间为6 h,组装浓度为10-4时,缓蚀效率最高,缓蚀效率可以达到83.2%。2利用PDA和1-DT的共同修饰制得了接触角为110°的疏水表面。该疏水表面是1-DT通过Cu-S键的形成作用于PDA的裂缝当中。且SEM结果表明该疏水表面的抗腐蚀效果良好。3在PDA和1-DT的疏水膜的基础上又引入了银纳米粒子,SEM结果表明该复合膜对大肠杆菌有很好的抗菌性,修饰银纳米粒子的铜表面存在最少的大肠杆菌。
[Abstract]:Copper has excellent electrical conductivity, thermal conductivity, mechanical properties and formability, so copper as an important metal has been widely used in many fields. However, copper is a chemically active metal. Seawater contains not only chloride ions that can coordinate with copper, but also microorganisms that can corrode copper, such as Escherichia coli. Therefore, it is important to study the corrosion inhibition of copper in seawater. In this paper, the method of surface modification is mainly used. One is to form a self-assembled film on the surface of pyrimidine molecule 4-phenylpyrimidine (4-PPM) containing nitrogen atom. The corrosion inhibition property of the self-assembled film is characterized by electrochemical impedance and electrochemical polarization curves. The corrosion inhibition efficiency obtained by different methods is calculated by using the relevant formulas. By using density functional theory (DFT), the maximum molecular occupied orbital (HOMO) and the lowest molecular non-occupied orbital (LUMO) and dipole moments are calculated. Finally, the adsorption configuration and homogeneity of the self-assembled films on the electrode surface were measured by Raman spectroscopy. The other is based on the adhesion of polydopamine (PDA) to the surface of copper by modifying the adhesive polydopamine and then modifying the hydrophobic dodecyl mercaptan (1-DT) to form a hydrophobic surface. The successful preparation of the hydrophobic film was characterized by contact angle measurement near infrared spectroscopy and X-ray photoelectron spectroscopy (XPS). The results of (SEM) show that the hydrophobic film has good corrosion inhibition ability to copper in seawater containing chloride ions. In addition, because silver nanoparticles have good antibacterial properties, silver nanoparticles are introduced on the surface of the hydrophobic film to delay the corrosion of copper caused by Escherichia coli. XPS was used to characterize the modification of silver nanoparticles, and SEM was used to show that the hydrophobic films modified by silver nanoparticles had good antibacterial properties. 1 4-PPM molecules were used as self-assembled molecules. The effects of different assembly time and different concentration of 4-PPM solution on the corrosion inhibition of copper were studied. When the assembly time is 6 h and the assembly concentration is 10-4, the corrosion inhibition efficiency is the highest, and the corrosion inhibition efficiency can reach 83.2.2 the hydrophobic surface with contact angle of 110 掳can be prepared by the modification of PDA and 1-DT. The hydrophobic surface is 1-DT acting on the cracks of PDA through the formation of Cu-S bond. The results of SEM showed that the corrosion resistance of the hydrophobic surface was good. (3) Silver nanoparticles were introduced into the hydrophobic film of PDA and 1-DT. The results of SEM showed that the composite film had a good antibacterial effect against Escherichia coli. The copper surface modified with silver nanoparticles contains the least amount of Escherichia coli.
【学位授予单位】:上海师范大学
【学位级别】:硕士
【学位授予年份】:2017
【分类号】:TG174.4

【参考文献】

相关期刊论文 前1条

1 林仲华,王逢春,田中群;2-氨基嘧啶对铜的缓蚀机理[J];物理化学学报;1992年01期



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