热处理铜铝复合板界面厚度关系模型的建立
发布时间：2019-03-01 14:08
【摘要】：研究了退火工艺参数与铜铝复合板界面层厚度的关系。结果发现,退火温度越高,退火时间越长,铜铝复合板界面层的厚度越大。在相同加热温度下,剥离强度均随着时间的延长而呈现出先增加后降低的趋势,退火温度越低,出现剥离强度最高值所需的时间越长。剥离强度与扩散过程中界面处的扩散运动有关。通过拟合铜铝复合板扩散层厚度与剥离强度,得到了剥离强度与扩散层厚度的关系,并给出剥离强度与热处理关系模型。
[Abstract]:The relationship between the annealing process parameters and the interfacial layer thickness of the copper-aluminum composite board was studied. The result shows that the higher the annealing temperature, the longer the annealing time, the greater the thickness of the interface layer of the copper-aluminum composite board. At the same heating temperature, the peel strength exhibited a tendency to decrease with time, and the lower the annealing temperature, the longer the time required for the highest peel strength. The peel strength is related to the diffusion motion at the interface in the diffusion process. The relationship between the peel strength and the thickness of the diffusion layer was obtained by fitting the thickness and the peel strength of the diffusion layer of the copper-aluminum composite board, and the relationship between the peel strength and the heat treatment was given.
【作者单位】： 沈阳工业大学材料材料科学与工程学院;
【基金】：国家自然科学基金资助项目(U1604251)
【分类号】：TG156
[Abstract]:The relationship between the annealing process parameters and the interfacial layer thickness of the copper-aluminum composite board was studied. The result shows that the higher the annealing temperature, the longer the annealing time, the greater the thickness of the interface layer of the copper-aluminum composite board. At the same heating temperature, the peel strength exhibited a tendency to decrease with time, and the lower the annealing temperature, the longer the time required for the highest peel strength. The peel strength is related to the diffusion motion at the interface in the diffusion process. The relationship between the peel strength and the thickness of the diffusion layer was obtained by fitting the thickness and the peel strength of the diffusion layer of the copper-aluminum composite board, and the relationship between the peel strength and the heat treatment was given.
【作者单位】： 沈阳工业大学材料材料科学与工程学院;
【基金】：国家自然科学基金资助项目(U1604251)
【分类号】：TG156
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