改进电解液中自催化沉淀铜及其特性（英文）

发布时间：2018-01-30 08:16

本文关键词： 化学镀铜添加剂动电位极化电化学阻抗谱　出处：《Transactions of Nonferrous Metals Society of China》2015年11期 　论文类型：期刊论文

【摘要】：研究了以TEA和EDTA为络合剂、多聚甲醛为还原剂、二硫基苯并噻唑为稳定剂、凝胶和动物胶为添加剂的镀铜化学沉积过程。化学镀铜溶液的稳定性可通过紫外可见分光光度仪测量溶液的吸光度来监测,在15 h内溶液都相当稳定。采用标准弯曲试验评估在低碳钢箔上铜膜的附着力,显示了很好的吸附性。XRD结果表明,铜膜具有(111)织构,而且,添加剂能够抑制(111)面的优先晶体生长,提高(220)织构的晶体生长速度。利用Scherrer公式从主峰计算铜膜的晶粒尺寸。SEM和AFM研究表明,这两种添加剂能够改善铜膜的晶体结构、晶粒尺寸和表面形貌。循环伏安法研究表明,添加剂能够被吸附在电极表面并降低沉积速率。动电位极化和电化学阻抗研究表明,有添加剂时产生的沉淀具有更高的耐腐蚀性。
[Abstract]:Using TEA and EDTA as complexing agent, paraformaldehyde as reducing agent and dithiobenzothiazole as stabilizer were studied. The stability of electroless copper plating solution can be monitored by UV-visible spectrophotometer. The solution is quite stable within 15 h. The adhesion of copper film on low carbon steel foil is evaluated by standard bending test. The results of XRD show that the copper film has a texture of 11.1). The additive can inhibit the preferential crystal growth of the surface. Scherrer formula was used to calculate the grain size of copper film from the main peak. The results of SEM and AFM showed that the crystal growth rate of Cu film was improved. These two additives can improve the crystal structure, grain size and surface morphology of copper film. The additives can be adsorbed on the electrode surface and the deposition rate can be reduced. The results of potentiodynamic polarization and electrochemical impedance show that the precipitates produced by the additives have higher corrosion resistance.
【作者单位】： Electroplating
【分类号】：TG174.4
【正文快照】： 1 IntroductionAuto catalytic copper plating(ACP)or electrolessplating has been a hot area in the electronic industry fordecades.Electroless copper plating is mostly used formetallization in the fabrication of printed circuit boardsand other electronic de

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