Cu-Ti合金薄膜的微结构和力学性能

发布时间：2018-03-04 04:21

本文选题：铜合金薄膜　切入点：超过饱和固溶体　出处：《稀有金属材料与工程》2015年12期 　论文类型：期刊论文

【摘要】：通过磁控共溅射方法制备了一系列不同Ti含量的Cu-Ti合金薄膜,采用EDS、XRD、TEM、AFM和纳米力学探针表征了薄膜的微结构和力学性能,研究了化合物对超过饱和固溶薄膜的强化作用。结果表明,由于溅射粒子的高分散性和薄膜生长的高非平衡性,Cu-Ti薄膜形成了超过饱和固溶体,晶格的剧烈畸变使Cu固溶体晶粒迅速细化。随Ti含量的增加,薄膜中产生高分散的细小Cu Tix化合物,并逐步形成Cu超过饱和固溶体纳米晶和细小化合物分布于非晶基体中的结构。与微结构的变化相应,薄膜的硬度随Ti含量的增加持续提高,并在含21.4%Ti(原子分数)时达到8.7GPa的最高值。高分散金属间化合物的存在是Cu-Ti合金薄膜在形成非晶结构后硬度得以继续提高的原因。
[Abstract]:A series of Cu-Ti alloy films with different Ti content were prepared by magnetron co-sputtering. The microstructure and mechanical properties of the films were characterized by EDS-XRDX Tem AFM and nano-mechanical probe. The strengthening effect of the compound on the supersaturated solid solution film is studied. The results show that due to the high dispersion of the sputtering particles and the highly unbalanced Cu-Ti film, the ultrasaturated solid solution is formed. With the increase of Ti content, fine Cu Tix compounds are produced in the films with the rapid refinement of Cu solid solution grains due to the severe lattice distortion. The microstructure of Cu nanocrystals and fine compounds distributed in amorphous substrates is gradually formed. The hardness of the films increases with the increase of Ti content, corresponding to the change of microstructure. The highest value of 8.7GPa is obtained at the concentration of 21.4% Ti (atomic fraction). The existence of highly dispersed intermetallic compounds is the reason why the hardness of Cu-Ti alloy films continues to increase after the formation of amorphous structure.
【作者单位】：上海交通大学金属基复合材料国家重点实验室;
【基金】：国家重点基础研究发展计划(“973”计划)(2012CB619601) 国家自然科学基金(51371118)
【分类号】：TG174.4

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