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TC4钛合金直流液相等离子体法强化层的生长

发布时间:2018-03-26 03:44

  本文选题:钛合金 切入点:直流液相等离子体法 出处:《中国表面工程》2015年06期


【摘要】:为了进一步研究TC4钛合金在直流液相等离子体法强化过程中的温度变化,探索强化层的生长过程,通过液相等离子体电解强化技术在TC4钛合金表面制备强化层。使用热电偶测量强化过程中的试样温度变化,通过扫描电子显微镜(SEM)、能谱仪(EDS)、显微硬度等测试方法分别研究强化层的表面形貌、显微结构、元素分布和硬度。结果表明,较高的试样温度(约500℃)有利于TC4钛合金得到表面完整、均匀的强化层,而260V左右的处理电压能使试样达到该温度。表面化合物层以Ti(C,N)相为主,化合物层下有碳氮元素渗入基体。经过处理的强化层硬度较基体明显提升,近表层硬度可达784HV0.01。研究表明,TC4钛合金强化层的生长分为4个阶段:基材预热阶段、初步起弧阶段、表面弧光渗氮阶段和碳氮化合物层向外生长阶段。
[Abstract]:In order to further study the temperature change of TC4 titanium alloy during direct current liquid phase plasma strengthening, the growth process of the strengthened layer was explored. The strengthening layer was prepared on the surface of TC4 titanium alloy by means of liquid phase plasma electrolytic strengthening technique. The temperature change of the specimen during the strengthening process was measured by thermocouple. The surface morphology, microstructure, element distribution and hardness of the strengthened layer were studied by means of scanning electron microscope (SEM), energy spectrometer (EDS) and microhardness. The higher sample temperature (about 500 鈩,

本文编号:1666191

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