磁头无铅微焊点液滴飞溅和失效性分析

发布时间：2018-04-03 02:33

本文选题：钎料液滴飞溅　切入点：氮气压力　出处：《电子学报》2015年04期

【摘要】：磁头无铅微焊点可靠性分析主要包括焊点前期液滴飞溅的防护和后期焊点失效性分析,在实际生产中,应用钎料球喷射连接技术时,钎料液滴飞溅时有发生,本文融合激光加热和氮气压力技术,建立了一种新的用于计算磁头内置DFH控制元件连接钎料液滴冲击速度的双液滴模型,同时,采用正交试验法对比了不同激光加热参数和氮气压力条件下磁头内置DFH控制元件连接钎料液滴飞溅的情况,并进一步融合可控扫描式磁场和偏置两种方法,研究了磁头微焊点的失效情况.试验结果表明:下落前,激光脉冲能量是决定液滴温度的主要因素;下落后,对钎料液滴温度影响最大的是钎料液滴的初始温度.磁头无铅微焊点失效是焊点液滴飞溅和金属间化合物共同作用的结果.
[Abstract]:The reliability analysis of magnetic head lead-free micro-solder joint mainly includes the protection of droplet spatter in the early stage of solder joint and the analysis of the later failure of solder joint. In actual production, when the solder ball spray connection technology is used, the droplet splashing of solder occurs frequently.In this paper, a new dual droplet model for calculating the impact velocity of solder droplet connected with DFH control element is established by combining laser heating and nitrogen pressure technology. At the same time,The splashing of solder droplets connected with the DFH control element of the magnetic head with different laser heating parameters and nitrogen pressure was compared by orthogonal test, and the two methods of controllable scanning magnetic field and bias were further combined.The failure of magnetic head micro-solder joint was studied.The experimental results show that the laser pulse energy is the main factor to determine the droplet temperature before falling, and the initial temperature of the solder droplet is the most important factor after falling.The failure of magnetic head lead-free micro-solder joint is the result of the joint action of droplet splashing and intermetallic compound.
【作者单位】：湖南大学电气与信息工程学院;中南大学信息科学与工程学院;日本TDK集团;
【基金】：国家自然科学基金(No.61173108,No.60973032,No.60673084,No.61272147) 湖南省自然科学基金(No.10JJ2045) 湖南省学位与研究生教育教改(No.JG2011C004)
【分类号】：TG454

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