基于光滑粒子流体动力学法单颗磨粒超声辅助磨削陶瓷材料的磨削力仿真研究

发布时间：2018-04-04 23:26

本文选题：机械制造工艺与设备　切入点：超声辅助磨削　出处：《兵工学报》2015年06期

【摘要】：为了揭示轴向超声振动对磨削Si C陶瓷、Al2O3陶瓷的磨削力影响机制,利用光滑粒子流体动力学(SPH)法对单颗金刚石磨粒磨削Si C陶瓷、Al2O3陶瓷的磨削力进行仿真,提出在单颗磨粒模拟磨削中应将平均未变形切屑厚度作为磨削深度。通过分析轴向超声振动振幅与磨粒速度对平均未变形切屑厚度的影响,发现平均未变形切屑厚度随着超声振动振幅的增加而减小、随着磨粒速度的降低而减小。仿真结果表明:与普通磨削(CG)相比,轴向超声振动能够有效降低磨削力;随着超声振动振幅的增加磨削力降低比率增大;在相同磨削参数下,磨粒切削Si C陶瓷时磨削力大于切削Al2O3陶瓷的磨削力。
[Abstract]:In order to reveal the influence mechanism of axial ultrasonic vibration on grinding force of sic ceramic and Al2O3 ceramic, the grinding force of single diamond abrasive particle grinding sic ceramic and Al2O3 ceramic was simulated by smooth particle hydrodynamics (SPH) method.It is suggested that the average undeformed chip thickness should be taken as the grinding depth in the simulation grinding of single abrasive particle.By analyzing the effects of axial ultrasonic vibration amplitude and abrasive particle velocity on the average undeformed chip thickness, it is found that the average undeformed chip thickness decreases with the increase of ultrasonic vibration amplitude and decreases with the decrease of abrasive particle velocity.The simulation results show that the axial ultrasonic vibration can effectively reduce the grinding force compared with the ordinary grinding CGs, and with the increase of the amplitude of ultrasonic vibration, the ratio of grinding force reduction increases; under the same grinding parameters, the axial ultrasonic vibration can effectively reduce the grinding force.The grinding force of abrasive cutting sic ceramics is greater than that of cutting Al2O3 ceramics.
【作者单位】：北京理工大学先进加工技术国防重点学科实验室;
【基金】：国家自然科学基金项目(51205024) 北京理工大学基础研究基金项目(20130342024)
【分类号】：TG580.6

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