TFT-LCD玻璃基板精细雾化抛光的工艺参数优化

发布时间：2018-04-20 20:40

  本文选题：化学机械抛光 + 玻璃基板　； 参考：《中国表面工程》2015年02期

【摘要】：为了研究抛光工艺参数(抛光压力、抛光台转速、抛光液流量)对精细雾化抛光TFT-LCD玻璃基板的影响,实现对玻璃基板的高效、高质量加工,采用正交试验方法对玻璃基板进行雾化抛光,以材料去除率(MRR)和表面粗糙度(Ra)为评价指标,根据实验结果得到最优的工艺参数组合,并将传统抛光和雾化抛光进行了对比。结果表明:当压力为0.055 MPa,抛光台转速为65r/min,抛光液流量为8.3mL/min时,雾化抛光的材料去除率为219nm/min,表面粗糙度Ra为1.1nm,光学透过率≥92.6%。在相同的试验条件下,传统抛光的去除率和表面粗糙度分别为335nm/min和1.2nm,两种方法的抛光效果相近,但雾化方法抛光液用量仅为传统的1/10。
[Abstract]:In order to study the effect of polishing process parameters (polishing pressure, polishing table speed, polishing liquid flow) on fine atomization polishing TFT-LCD glass substrate, the high efficiency and high quality processing of glass substrate can be realized. The glass substrate was atomized by orthogonal test. The material removal rate (MRR) and the surface roughness (Raa) were taken as the evaluation indexes. The optimal combination of process parameters was obtained according to the experimental results, and the traditional polishing and atomization polishing were compared. The results show that when the pressure is 0.055 MPA, the rotating speed of polishing table is 65 r / min and the flow rate of polishing liquid is 8.3mL/min, the material removal rate of atomization polishing is 219nm / min, the surface roughness Ra is 1.1 nm, and the optical transmittance is 鈮，

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