单晶硅电池板焊带钎焊工艺及可靠性研究

发布时间：2018-04-25 01:22

本文选题：单晶硅电池 + 焊带　；参考：《哈尔滨工业大学》2015年硕士论文

【摘要】：太阳能被认为是21世纪最重要的新能源,对解决人类能源危机和环境问题具有重要的意义。太阳能发电技术的核心是太阳能电池组件,而硅电池板和焊带的钎焊连接作为太阳能电池组件制作过程中最重要的工序,直接影响着电池组件的光电转化效率和使用寿命。目前,准备将民用的单晶硅电池板用于空间卫星,但其焊点在空间大温差的工作条件下可靠性不足,无法满足空间卫星的使用要求。本课题的目标是研究满足空间卫星使用要求的新的钎焊工艺,使焊点满足热循环性能要求和剥离力要求,并对互连焊点进行可靠性研究。本课题对比研究了手工点焊和热压钎焊两种钎焊工艺方案,甄选出热循环性能较好的热压钎焊方案,应用正交试验方法对热压钎焊方案进行了参数优化,通过正交试验直观分析和方差分析,确定最优参数组,并明确参数对试验结果的影响程度。最优参数组所焊接的焊点热循环测试和剥离力测试表明,其性能满足了航天测试标准。对Sn-37Pb、Sn-3.5Ag和Sn-3.0Ag-0.5Cu钎料与银浆界面进行了界面反应研究和失效分析,热压钎焊焊后三种钎料与银浆的界面均出现了Ag_3Sn薄层。本课题对热循环实验后界面化合物Ag_3Sn的厚度和钎料微观组织进行了表征,随着热循环试验的不断进行,界面的变化主要包括两部分,一是界面化合物Ag_3Sn不断变厚,且Sn-37Pb/Ag界面处Ag_3Sn生长最快;二是钎料中金属间化合物或固溶体相逐渐粗化。对热压钎焊工艺所焊接的Sn-37Pb/Ag、Sn-3.0Ag-0.5Cu/Ag和Sn-3.5Ag/Ag三种接头Ag_3Sn的时效生长和动力学进行了研究,确定Ag_3Sn为抛物线型生长。计算了不同温度下Ag_3Sn的生长速率常数,得到Sn-37Pb/Ag、Sn-3.5Ag/Ag和Sn-3.0Ag-0.5Cu/Ag界面化合物生长激活能,分别为113.3 kJ/mol、129.9 kJ/mol、123.1 kJ/mol。
[Abstract]:Solar energy is regarded as the most important new energy in the 21st century. The core of the solar power generation technology is the solar cell module. As the most important process in the process of making the solar cell module, the soldering connection between the silicon battery panel and the soldering tape directly affects the photoelectric conversion efficiency and service life of the battery module. At present, the single crystal silicon battery panel for civil use is ready to be used in space satellite, but the solder joint is not reliable enough to meet the requirements of space satellite under the condition of large temperature difference in space. The aim of this paper is to study the new brazing technology to meet the requirements of space satellite, to make the solder joints meet the requirements of thermal cycling performance and peeling force, and to study the reliability of interconnect solder joints. In this paper, two kinds of brazing schemes, manual spot welding and hot press brazing, are compared and studied. The hot pressing brazing schemes with better thermal cycling performance are selected. The parameters of the hot pressing brazing schemes are optimized by orthogonal test method. The optimal parameter group was determined by means of visual analysis and variance analysis of orthogonal test, and the degree of influence of parameters on the test results was determined. The thermal cycle test and peeling force test of solder joint welded by the optimal parameter group show that its performance meets the aerospace test standard. The interfacial reaction and failure analysis of Sn-37PbSn-3.5Ag and Sn-3.0Ag-0.5Cu solder with silver paste were carried out. After hot pressing brazing, Ag_3Sn thin layers were found at the interface between the three solders and the paste. The thickness of interfacial compound Ag_3Sn and the microstructure of solder were characterized in this paper. With the development of thermal cycling experiment, the change of interface mainly includes two parts, one is that the interfacial compound Ag_3Sn is thicker and thicker. At the interface of Sn-37Pb/Ag, Ag_3Sn grows fastest, and the intermetallic compound or solid solution phase in solder gradually coarsenes. The aging growth and kinetics of Sn-37Pb / AgSn-3.0 Ag-0.5Cu / Ag and Sn-3.5Ag/Ag joints were studied. The results show that Ag_3Sn is parabolic growth. The growth rate constants of Ag_3Sn at different temperatures were calculated and the activation energies of Sn-37Pb / AgSn-3.5 Ag- / Ag and Sn-3.0Ag-0.5Cu/Ag interfacial compounds were obtained, which were 113.3 KJ / mol / 129.9 KJ / mol / 123.1 KJ / mol, respectively.
【学位授予单位】：哈尔滨工业大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TM914.41;TG454

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