液态时效条件下Zn元素的添加对共晶Sn-58Bi焊料力学性能的影响（英文）

发布时间：2018-05-23 08:09

本文选题：Zn + Sn-Bi焊料　；参考：《Transactions of Nonferrous Metals Society of China》2015年04期

【摘要】：对液态时效条件下Sn-58Bi-x Zn(x=0,0.7)焊料样品的力学性能(包括拉伸强度和蠕变性能)以及相关的界面反应进行研究。结果表明,在Sn-58Bi-0.7Zn焊料样品中,Bi的粗化现象和Cu-Sn界面金属间化合物的生长都得到了有效抑制。通过掺杂0.7%Zn,回流焊接后焊条样品的极限拉伸强度比共晶Sn-58Bi的极限拉伸强度提高了6.05%,液态时效后的极限拉伸强度则提升了5.50%。对于焊点样品,掺杂0.7%Zn后的极限拉伸强度相比Cu/Sn-58Bi/Cu在回流焊接后提升21.51%,而在液态时效后则提升29.27%。焊点强度的增加是由于Zn的掺杂导致Bi晶粒细化,使得断裂面从Cu和界面金属间化合物界面处转移到了界面金属间化合物和焊料界面处。纳米压痕的结果显示,通过向共晶Sn-58Bi焊料中掺杂0.7%Zn,焊料的抗蠕变性在回流焊接和液态时效后都有较大幅度的提升。
[Abstract]:The mechanical properties (including tensile strength and creep property) and the interfacial reaction of Sn-58Bi-x zinco x 0. 7) solder under liquid aging condition were studied. The results show that the coarsening of Bi in Sn-58Bi-0.7Zn solder and the growth of intermetallic compounds at Cu-Sn interface are effectively inhibited. By doping 0.7 Zn, the ultimate tensile strength of the electrode sample after reflux welding is 6.05 higher than that of eutectic Sn-58Bi, and the ultimate tensile strength of liquid aged electrode is 5.50% higher than that of eutectic Sn-58Bi. For solder joint samples, the ultimate tensile strength of doped 0.7%Zn is 21.51% higher than that of Cu/Sn-58Bi/Cu after reflux welding, and 29.27% after liquid aging. The increase in the strength of the solder joint is due to the refinement of Bi grain by Zn doping, which leads to the transfer of the fracture surface from the interface between Cu and intermetallic compounds to the intermetallic compound and solder interface. The results of nanocrystalline indentation show that the creep resistance of eutectic Sn-58Bi solder can be improved greatly after reflux welding and liquid aging by doping 0.7 Zn into eutectic Sn-58Bi solder.
【作者单位】：天津大学理学院应用物理系;天津大学天津市低维功能材料物理与制备技术重点实验室;
【基金】：Project(51074112)supported by the National Natural Science Foundation of China
【分类号】：TG42

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