基体负偏压对类金刚石涂层结构和性能的影响

发布时间：2018-06-27 14:29

本文选题：DC-PECVD + 类金刚石　；参考：《材料工程》2015年08期

【摘要】：采用直流等离子体增强化学气相沉积技术(DC-PECVD),通过控制基体负偏压的变化在YG8硬质合金基体上制备一系列类金刚石涂层。选用扫描电子显微镜、原子力显微镜、拉曼光谱、X射线光电子能谱、粗糙度仪对涂层形貌和结构进行表征测试。同时,利用显微硬度计、划痕测试仪系统地分析涂层的显微硬度和界面结合性能。结果表明:随着负偏压增大,涂层表面形貌逐渐平整光滑、致密,颗粒尺寸减小及数量降低。拉曼光谱表明,涂层具有典型的类金刚石结构,涂层中sp3键含量呈先增大后减小趋势,最大值约67.9%出现在负偏压为1000V左右,负偏压过大导致sp3键含量降低。显微硬度随负偏压变化规律与sp3键基本相符,sp3键含量决定显微硬度值大小。负偏压过大对吸附离子产生反溅射作用导致涂层厚度减小。当负偏压为1100V时,涂层与基体间的界面结合性能最优。
[Abstract]:A series of diamond-like carbon coatings were prepared on YG8 cemented carbide substrate by controlling the negative bias of substrate by DC plasma enhanced chemical vapor deposition (DC-PECVD). The morphology and structure of the coating were characterized by scanning electron microscope (SEM), atomic force microscope (AFM), Raman spectroscopy (Raman spectrum) and X-ray photoelectron spectroscopy (XPS). At the same time, the microhardness and interface bonding properties of the coatings were systematically analyzed by microhardness tester and scratch tester. The results show that with the increase of negative bias voltage, the surface morphology of the coating becomes smooth and compact, and the particle size decreases and the number decreases. Raman spectra show that the coating has a typical diamond-like carbon structure. The sp3 bond content in the coating increases first and then decreases. The maximum value of 67.9% occurs at the negative bias voltage of 1000V, and the sp3 bond content decreases when the negative bias voltage is too large. The change of microhardness with negative bias voltage is basically consistent with that of sp3 bond and the content of sp3 bond determines the value of microhardness. When the negative bias voltage is too large, the thickness of the coating decreases due to the anti-sputtering effect of the adsorbed ions. When the negative bias voltage is 1100V, the interfacial bonding between the coating and the substrate is optimal.
【作者单位】：北京航空材料研究院;华东理工大学机械与动力工程学院;中航工业南方航空工业(集团)有限公司;赛屋涂层技术有限公司;
【分类号】：TG174.4

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