电子封装用无铅药芯焊锡丝配套助焊剂的研制

发布时间：2018-07-10 06:21

本文选题：药芯焊锡丝 + 松香基助焊剂　；参考：《华南理工大学》2015年硕士论文

【摘要】：无卤素免清洗松香基助焊剂具有环保、安全和焊接可靠性高等优点,在无铅焊锡丝中的应用逐渐增多,但目前针对焊锡丝用无卤素环保助焊剂的研究尚不多见,缺乏能够完全替代传统高卤素助焊剂的产品。本论文工作深入研究了助焊剂载体、活性剂、表面活性剂、高沸点溶剂和成膜性增塑剂组分对无卤素免清洗松香基助焊剂性能的影响,并采用手工焊接方式对焊锡丝助焊剂进行实际效果考察,最后对助焊剂配方体系进行优化。通过Sn-0.7Cu无铅焊料的扩展率、焊后表面绝缘电阻、最大分解压力、正交试验、热重法、烟雾量及刺激性等测试研究了载体、活性剂、表面活性剂、高沸点溶剂及成膜性增塑剂对松香基助焊剂活性的影响。研究结果表明:(1)以质量比为2:3的125松香和无色氢化松香复配作为助焊剂载体时,可赋予其扩展率较高、烟雾量适中、最大分解压力较小且焊后电气性能优异等优势;(2)活性剂的最佳用量为4.0 wt%-6.0wt%,在优选总量为5.0 wt%的条件下,采用丁二酸胺:癸二酸:戊二酸为1:2:6,不同活性梯度的有机酸及有机胺类活性剂复配有利于助焊剂获得较宽的活性作用温度区间,有效提升无铅钎料对基底的润湿能力。(3)1.5wt%的氟碳类表面活性剂FSN-100加入量可以使助焊剂获得较佳的润湿性能。(4)采用乙二醇丁醚为主,DBE为辅的高沸点溶剂,优化后确定二者最佳比例为4:1,添加总量为3 wt%。将自制助焊剂制成无铅药芯焊锡丝,采用手工焊接方式检验助焊剂的实际使用效果发现自制助焊剂具有上锡速度慢且飞溅略多等不足。通过寻找到一种高活性的碘酸盐D2,添加0.7wt%含量到原助焊剂体系中,在兼顾其他性能方面的前提下可显著提升焊接速度;添加成膜性增塑剂氢化松香甲基酯对无铅焊锡丝的飞溅及焊后电气性能都有较好的改善作用,其含量以7.0wt%为宜。将优化后的助焊剂与合作公司及日本某知名品牌同类型的商品助焊剂进行综合性能对比,本研究自制助焊剂的综合性能良好。
[Abstract]:Non-halogen cleaning rosin based flux has the advantages of environmental protection, high safety and high welding reliability, and its application in lead-free solder wire is increasing gradually. However, there are few researches on halogen free environmental flux for solder wire at present. There is a lack of products that can completely replace traditional high-halogen fluxes. In this paper, the effects of flux carrier, active agent, surfactant, high boiling point solvent and film-forming plasticizer on the properties of rosin based flux without halogen cleaning were studied. The actual effect of solder wire flux was investigated by manual welding, and the flux formulation system was optimized. The support, active agent and surfactant were studied by testing the Sn-0.7Cu lead-free solder, the surface insulation resistance, maximum decomposition pressure, orthogonal test, thermogravimetry, smoke content and irritability. Effects of high boiling point solvent and film forming plasticizer on the activity of rosin-based flux. The results showed that: (1) when 125 rosin with 2:3 mass ratio and colorless hydrogenated rosin were used as the flux carrier, the expansion rate was higher and the smoke content was moderate. (2) the optimum dosage of the active agent is 4.0 wt- 6.0 wt. under the condition of the optimum concentration of 5.0 wt%, the maximum decomposition pressure is small and the electrical properties are excellent after welding. The mixture of succinamide, sebacic acid and glutaric acid was 1: 2: 6. The combination of organic acids and organic amines with different activity gradients was beneficial to the flux to obtain a wide range of active action temperature. The wetting ability of lead-free solder on the substrate was improved effectively. (3) the fluid-carbon surfactant FSN-100 was added to the solder to obtain better wettability. (4) the high boiling point solvent supplemented by ethylene glycol butyl ether was used. After optimization, the optimum ratio is 4: 1 and the total addition is 3 wts. The self-made flux is made into lead-free flux-cored solder wire. It is found that the self-made flux has some shortcomings such as slow tin speed and a little more spatter and so on. By finding a highly active iodate D2 and adding 0.7 wt% to the original flux system, the welding speed can be significantly improved on the premise of taking other properties into account. The addition of hydrogenated rosin methyl ester has a good effect on the splashing of lead-free solder wire and the improvement of electrical properties after welding, and the appropriate content is 7.0 wt%. The comprehensive performance of the optimized flux is compared with that of the same type of commodity flux of the cooperative company and a famous brand in Japan. The comprehensive performance of the self-made flux is good.
【学位授予单位】：华南理工大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TG42

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