钼合金磁控溅射镀镍薄膜工艺及后续热处理
发布时间：2018-07-20 10:26
【摘要】：目的优化钼表面直流磁控溅射镀镍薄膜的工艺,提出后续热处理方法。方法设计正交实验,探究溅射功率、溅射气压、负偏压和沉积时间对镍薄膜沉积速率和附着力的影响,从而优化工艺参数。利用扫描电镜和平整度仪对最佳工艺参数下制备的薄膜的组织结构进行表征,并研究后续热处理对薄膜附着力的影响。结果工艺参数对镀镍薄膜沉积速率影响的主次顺序为:功率溅射气压负偏压;对薄膜附着力的影响主次顺序为:负偏压沉积时间功率溅射气压。随溅射功率增大,沉积速率增大,薄膜附着力先增后减;随溅射气压增大,沉积速率和薄膜附着力均先增后减。负偏压增大对沉积速率影响较小,但有利于提高薄膜附着力。随沉积时间延长,薄膜附着力降低。在氢气气氛下进行850℃×1 h的后续热处理,能够促进扩散层的形成,明显提高镍薄膜的附着力。结论最佳镀镍工艺参数为:溅射功率1.8 k W,溅射气压0.3 Pa,负偏压450 V,沉积时间10 min。在该条件下制备的镍薄膜厚度达到1.15μm左右,与基体结合紧密,表面平整、连续、致密。后续增加热处理工序是提高镍薄膜附着力的有效方法。
[Abstract]:Aim to optimize the process of nickel plating on molybdenum surface by DC magnetron sputtering, and to propose a follow-up heat treatment method. Methods orthogonal experiments were designed to study the effects of sputtering power, sputtering pressure, negative bias voltage and deposition time on the deposition rate and adhesion of nickel film. The microstructure of the films prepared under the optimum technological parameters was characterized by scanning electron microscopy (SEM) and flatness analyzer. The effect of subsequent heat treatment on the adhesion of the films was studied. Results the primary and secondary order of the influence of process parameters on the deposition rate of nickel-plated films was as follows: the negative bias of power sputtering pressure and the primary and secondary order of influence on the adhesion of the films were: negative bias deposition time power sputtering pressure. With the increase of sputtering power, the deposition rate increases and then decreases, and with the increase of sputtering pressure, the deposition rate and film adhesion increase first and then decrease. The increase of negative bias voltage has little effect on the deposition rate, but it can improve the adhesion of the film. With the increase of deposition time, the adhesion of the film decreases. After heat treatment at 850 鈩，
本文编号：2133231
[Abstract]:Aim to optimize the process of nickel plating on molybdenum surface by DC magnetron sputtering, and to propose a follow-up heat treatment method. Methods orthogonal experiments were designed to study the effects of sputtering power, sputtering pressure, negative bias voltage and deposition time on the deposition rate and adhesion of nickel film. The microstructure of the films prepared under the optimum technological parameters was characterized by scanning electron microscopy (SEM) and flatness analyzer. The effect of subsequent heat treatment on the adhesion of the films was studied. Results the primary and secondary order of the influence of process parameters on the deposition rate of nickel-plated films was as follows: the negative bias of power sputtering pressure and the primary and secondary order of influence on the adhesion of the films were: negative bias deposition time power sputtering pressure. With the increase of sputtering power, the deposition rate increases and then decreases, and with the increase of sputtering pressure, the deposition rate and film adhesion increase first and then decrease. The increase of negative bias voltage has little effect on the deposition rate, but it can improve the adhesion of the film. With the increase of deposition time, the adhesion of the film decreases. After heat treatment at 850 鈩，
本文编号：2133231
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