Cu-金刚石复合镀层的制备

发布时间：2018-08-16 14:18

【摘要】：采用复合电镀技术,在酸性硫酸盐镀铜电镀液中加入粒径为20μm的金刚石粉体制备Cu-金刚石复合镀层。通过正交试验优化Cu-金刚石复合电镀的工艺参数,采用扫描电镜(SEM)、能谱仪(EDS)和显微硬度计研究CuSO_4·5H_2O浓度、阴极电流密度、金刚石粉体浓度和镀液温度对镀层质量的影响。采用X射线分析仪(XRD)、扫描电镜(SEM)和摩擦实验机表征优化后复合镀层的相结构、表面形貌及摩擦性能。结果表明:优化的镀液组成和工艺参数为CuSO_4·5H_2O 190 g/L,H_2SO_4 60 g/L,阴极电流密度10 A/dm~2,金刚石粉体浓度20 g/L,镀液温度20℃;优化后的复合镀层晶粒均匀,金刚石粉体质量分数为21.50%,具有较好的显微硬度和摩擦性能。
[Abstract]:Cu-diamond composite coating was prepared by adding diamond powder with diameter of 20 渭 m into acid sulfate copper plating solution by composite electroplating technology. The process parameters of Cu-diamond composite electroplating were optimized by orthogonal test. The effects of CuSO_4 5H_2O concentration, cathodic current density, diamond powder concentration and bath temperature on the coating quality were studied by scanning electron microscope (SEM) (SEM), energy spectrometer (EDS) and microhardness meter. The phase structure, surface morphology and tribological properties of the optimized composite coating were characterized by X-ray analyzer (XRD), scanning electron microscope (SEM) and friction tester. The results show that the optimized bath composition and process parameters are CuSO_4 5H_2O 190g / L, the cathode current density is 10 / A / dm-2, the concentration of diamond powder is 20 g / L, the bath temperature is 20 鈩，

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