硅对热浸镀ZnAl4合金镀层组织及生长动力学的影响
发布时间：2018-09-11 05:47
【摘要】：采用热浸镀法在纯铁片表面制备锌铝合金镀层,研究纯铁片在锌铝熔池(ZnAl4)中的界面反应,分析熔池中添加硅元素对镀层组织与生长动力学的影响。结果表明:随热镀时间延长,锌铝凝固组织与基体间的金属间化合物层(即中间合金层)的厚度增加。熔池中加入0.15%Si时,铁铝金属间化合物层的生长受到抑制,厚度减小,特别是在600℃时厚度减小更明显。Si在金属间化合物层中富集,使Fe和Al原子通过液相通道相互扩散受到阻碍,铁铝抑制层稳定存在,从而降低金属间化合物层的厚度。熔池中硅含量增加至0.30%时,对于铁锌合金层的抑制作用消失,合金层结构与不含硅时相似,形成Fe_2Al_5/FeAl_3/(Zn-Al)液相凝固组织。中间合金层的厚度随时间延长呈抛物线增长,表明镀层的形成受扩散控制;但适量硅在中间合金层的溶解能阻碍铁锌原子的扩散,从而抑制镀层过度生长。
[Abstract]:Zn-Al alloy coating was prepared on the surface of pure iron by hot dip plating. The interface reaction of pure iron in ZnAl4 was studied. The effect of silicon addition on the microstructure and growth kinetics of the coating was analyzed. The results show that the thickness of intermetallic compound layer (i.e. master alloy layer) between solidified structure and substrate increases with the increase of hot plating time. With the addition of 0.15%Si in the molten pool, the growth of the Fe-Al intermetallic compound layer was inhibited, and the thickness decreased, especially at 600 鈩，
本文编号：2235713
[Abstract]:Zn-Al alloy coating was prepared on the surface of pure iron by hot dip plating. The interface reaction of pure iron in ZnAl4 was studied. The effect of silicon addition on the microstructure and growth kinetics of the coating was analyzed. The results show that the thickness of intermetallic compound layer (i.e. master alloy layer) between solidified structure and substrate increases with the increase of hot plating time. With the addition of 0.15%Si in the molten pool, the growth of the Fe-Al intermetallic compound layer was inhibited, and the thickness decreased, especially at 600 鈩，
本文编号：2235713
本文链接：https://www.wllwen.com/kejilunwen/jinshugongy/2235713.html
教材专著
