通过添加POSS颗粒抑制锡基无Pb焊层的晶须生长

发布时间：2018-10-14 17:45

【摘要】：在Sn,Sn-3.0Ag-0.5Cu和Sn42-Bi58钎料中添加具有纳米结构的笼形硅氧烷齐聚物(POSS)作为增强相,研究了增强相在恒温恒湿(85℃,相对湿度85%)条件下对锡基无Pb焊层晶须生长行为的影响.结果表明,在恒温恒湿条件下,锡基无Pb焊层晶须生长的驱动力是Sn的氧化物生成引起体积膨胀从而对周围焊层产生的压应力;添加POSS可以有效缓解金属Sn的氧化进程,抑制Sn的氧化物生成,从而减缓晶须生长;在Sn,Sn3.0Ag0.5Cu和Sn58Bi焊层中,Sn焊层晶须生长能力最强,Sn58Bi焊层晶须生长能力最弱.
[Abstract]:Sn,Sn-3.0Ag-0.5Cu and Sn42-Bi58 solders were filled with caged siloxane oligomer (POSS) with nano-structure as reinforcement phase. The effect of reinforcing phase on whisker growth behavior without Pb layer on tin substrate was studied under constant temperature and humidity (85 鈩，

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