三维队列微电极在微细电火花加工的应用

发布时间：2018-11-04 16:14

【摘要】：研究了三维微型腔模具的制备方法。该方法基于微型双工位分层实体制造工艺(DLOM),通过多层铜箔二维微结构叠加拟合出三维队列微电极,将制备的微电极用于微细电火花加工来制得三维微型腔模具。首先,利用线切割对100μm厚的多层铜箔进行逐层切割,获得多层二维微结构。然后,通过真空压力热扩散焊对多层铜箔二维微结构进行连接,叠加拟合出三维队列微电极。最后,在电压80V,脉冲频率0.2MHZ,脉冲宽度800ns,休止脉宽4 200ns的作用下,将上述工艺制备的三维队列微电极用于微细电火花加工,获得表面质量良好、形状与尺寸精度较高的三维微型腔模具。为了有效减少电极损耗对加工精度的不利影响,使用队列电极中的微电极依序对三维微型腔进行了加工。基于上述研究结果,制备了两种形状的三维队列微电极并通过微细电火花加工获得了表面粗糙度Ra为0.48μm的三维微型腔模具。与目前主流的微细电极逐层扫描放电加工三维微结构的工作方式相比,提出的三维微电极只需进行上下往返式加工便可获得三维微型腔模具,工作效率高且损耗低。
[Abstract]:The preparation method of three-dimensional micro-cavity mould was studied. This method is based on the micro double position layered solid manufacturing process (DLOM), and fits the three-dimensional queue microelectrode by superposition of multi-layer copper foil two-dimensional microstructure. The prepared microelectrode is used in micro-EDM to produce three-dimensional micro-cavity mold. Firstly, the multilayer copper foil with thickness of 100 渭 m was cut layer by wire cutting, and the multi-layer two-dimensional microstructure was obtained. Then, the two-dimensional microstructure of multilayer copper foil was connected by vacuum pressure thermal diffusion welding, and the three-dimensional coiled microelectrode was fitted by superposition. Finally, under the action of voltage 80V, pulse frequency 0.2MHZ, pulse width 800ns, and repose pulse width 4 200ns, the three-dimensional queue microelectrode prepared by the above technology was used in micro-EDM, and the surface quality was good. Three-dimensional micro cavity die with high precision of shape and dimension. In order to effectively reduce the negative effect of electrode loss on machining accuracy, the three-dimensional microcavity was processed by using the microelectrodes in the queue electrode in sequence. Based on the above results, two kinds of three-dimensional coiled microelectrodes were prepared, and the 3D cavity mold with surface roughness Ra of 0.48 渭 m was obtained by micro-EDM. Compared with the main micro electrode layer by layer scanning discharge machining three dimensional micro structure working mode, the proposed three dimensional microelectrode can obtain the three dimensional micro cavity mould only by up and down round trip processing, and the work efficiency is high and the loss is low.
【作者单位】：哈尔滨工业大学机电工程学院微系统与微结构制造教育部重点实验室;深圳大学机电与控制工程学院深圳市模具先进制造技术重点实验室;深圳大学电子科学与技术学院深圳市激光工程重点实验室;
【基金】：国家自然科学基金资助项目(No.51405306,No.51175348,No.51205258) 中国博士后科学基金资助项目(No.2014M552233) 深圳市基础研究计划资助项目(No.JCYJ20140418095735629)
【分类号】：TG661

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