烧结压力对自钎剂钎料性能的影响
发布时间：2018-11-23 13:02
【摘要】：采用热压烧结法制备了Al-12Si自钎剂钎料环,对不同烧结压力下钎料的润湿性、显微硬度和显微组织进行了研究.结果表明,自钎剂钎料润湿性环随着烧结压力升高呈现上升趋势,在烧结压力为222 MPa时铺展面积达到152 mm2;随着烧结压力的增大,自钎剂钎料密度、显微硬度逐渐增大,但上升趋势变缓;钎料显微组织主要是灰色基体上均匀分布着黑色大块状相和白色小颗粒;XRD结果显示自钎剂钎料只有α-Al固溶体,初晶硅和Nocolok钎剂三种物相,热压烧结法制备自钎剂钎料未发生氧化、水解等反应,加上硅的活化作用保证了钎料高活性.
[Abstract]:The Al-12Si self-flux brazing ring was prepared by hot pressing sintering. The wettability, microhardness and microstructure of the solder under different sintering pressures were studied. The results show that the wettable ring of self-fluxing filler metal increases with the increase of sintering pressure, and the spreading area reaches 152 mm2; when sintering pressure is 222 MPa. With the increase of sintering pressure, the density and microhardness of the self-fluxing solder increase gradually, but the increasing trend becomes slower, and the microstructure of the solder is mainly composed of large black phases and small white particles distributed uniformly on the gray matrix. XRD results show that the solder has only three phases: 伪-Al solid solution, primary silicon and Nocolok flux. There are no oxidation and hydrolysis reactions in the solder prepared by hot pressing sintering, and the activation of silicon ensures the high activity of the solder.
【作者单位】： 郑州机械研究所新型钎焊材料与技术国家重点实验室;河南工业大学土木建筑学院;
【基金】：国际科技合作专项资助项目(2014DFR50820) 华南理工大学开放基金资助项目(2013001)
【分类号】：TG425
本文编号：2351713
[Abstract]:The Al-12Si self-flux brazing ring was prepared by hot pressing sintering. The wettability, microhardness and microstructure of the solder under different sintering pressures were studied. The results show that the wettable ring of self-fluxing filler metal increases with the increase of sintering pressure, and the spreading area reaches 152 mm2; when sintering pressure is 222 MPa. With the increase of sintering pressure, the density and microhardness of the self-fluxing solder increase gradually, but the increasing trend becomes slower, and the microstructure of the solder is mainly composed of large black phases and small white particles distributed uniformly on the gray matrix. XRD results show that the solder has only three phases: 伪-Al solid solution, primary silicon and Nocolok flux. There are no oxidation and hydrolysis reactions in the solder prepared by hot pressing sintering, and the activation of silicon ensures the high activity of the solder.
【作者单位】： 郑州机械研究所新型钎焊材料与技术国家重点实验室;河南工业大学土木建筑学院;
【基金】：国际科技合作专项资助项目(2014DFR50820) 华南理工大学开放基金资助项目(2013001)
【分类号】：TG425
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