集群磁流变效应平面抛光力特性试验研究

发布时间：2018-12-15 03:44

【摘要】：集群磁流变平面抛光加工硬脆材料可以高效率获得纳米/亚纳米级表面粗糙度,其中集群磁流变效应抛光垫对加工表面的作用力(抛光力)是材料去除的关键因素,搭建了集群磁流变平面抛光三向测力平台,对模拟的集群磁流变抛光加工过程抛光力(切向力F_t和法向力F_n)进行了系统试验研究。结果表明,2''单晶硅片试验条件下集群磁流变平面抛光切向力Ft最大达到32.25 N、法向力Fn最大达到62.35 N、F_t/F_n值为0.46~0.77;对抛光力影响最大的工艺参数是磁场强度和加工间隙,其次是羰基铁粉与磨料质量分数、磁流变液流量、抛光盘转速,工件摆幅与速率影响最小。集群磁流变平面抛光力大小以及Ft/Fn值随着工件材料硬度的增大而增大,具有低正压力高剪切力特征,有利于提高硬脆材料的超光滑平坦化抛光加工效果。
[Abstract]:The surface roughness of hard and brittle materials can be obtained efficiently by cluster magneto-rheological plane polishing, in which the force (polishing force) of the polishing pad on the machined surface is the key factor to remove the material. A three-direction force measuring platform was set up and the polishing force (tangential force F _ t and normal force F _ n) during the process of cluster magnetorheological polishing was studied systematically. The results show that the maximum tangential force (Ft) is 32.25 N and the normal force (Fn) is 62.35 NW / FSP 0.77 under the experimental condition of 2'monocrystalline silicon wafer. The most important technological parameters affecting polishing force are magnetic field strength and machining clearance, followed by carbonyl iron powder and abrasive mass fraction, flux of magnetorheological fluid, rotating speed of polishing disc, workpiece swing and speed. With the increase of hardness of workpiece, the polishing force and Ft/Fn value of cluster magnetorheological plane polishing increases with the increase of workpiece hardness, which has the characteristics of low positive pressure and high shear force, which is beneficial to improve the super-smooth and flat polishing effect of hard and brittle materials.
【作者单位】：广东工业大学机电工程学院;华侨大学脆性材料加工技术教育部工程研究中心;
【基金】：国家自然科学基金(51375097,U1034006) 高等学校博士学科点专项科研基金(20134420110001)资助项目
【分类号】：TG580.692

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