Bi含量对SnAgBi无铅焊料润湿性及接头强度的影响

发布时间：2019-02-28 10:34

【摘要】：以Sn-3.5%Ag-x Bi(x=0wt%、2wt%、3.5wt%、5wt%和7 wt%)为研究对象,通过润湿性试验和剪切试验探索了Bi含量对焊料润湿性和接头剪切强度的影响。结果表明,随着Bi含量的增大,Sn-3.5%Ag-x Bi焊料润湿角减小,润湿性能得到一定的提高。随着Bi含量的增加,钎焊接头剪切强度先是增大,然后减小,Bi含量为5%时剪切强度最大;当Bi含量从0增加到5%时,接头剪切强度明显增加。
[Abstract]:The effects of Bi content on wettability and shear strength of solder were investigated by wettability test and shear test with Sn-3.5%Ag-x Bi (xx0wt%, 2wt%, 3.5wt%, 5wt% and 7 wt%) as research objects. The results show that with the increase of Bi content, the wetting angle of Sn-3.5%Ag-x Bi solder decreases and the wettability is improved to a certain extent. With the increase of Bi content, the shear strength of brazed joint increases first and then decreases, and the shear strength of brazed joint increases when the content of Bi is 5%, and when the content of Bi increases from 0 to 5%, the shear strength of brazed joint increases obviously when the content of Bi increases from 0 to 5%.
【作者单位】： 合肥工业大学工业培训中心;合肥工业大学材料科学与工程学院;
【基金】：博士专项基金资助项目(JZ2014HGBZ0031)
【分类号】：TG42
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本文编号：2431734