阳极氧化沉积氢氧化铜法制备梯度润湿铜表面（英文）
发布时间：2019-05-07 00:17
【摘要】：提出一种在金属铜上制备梯度润湿表面(接触角变化范围90.3°~4.2°)的简易方法。采用改进的阳极氧化电化学沉积技术,通过向阳极氧化系统的双电极容器中滴加氢氧化钾溶液,使铜箔电极上氢氧化铜纳米带阵列的生长程度与密度随铜箔高度而变化,从而形成润湿性梯度。所制备的润湿梯度铜表面具有耐热耐水特性,当此铜表面置于100℃的水浴中10h后仍保持其润湿性梯度。SEM、XRD和XPS测试结果表明,铜表面的氢氧化铜纳米带阵列的生长特性与分布是形成润湿性梯度的主要原因。
[Abstract]:A simple method for preparing gradient wetting surface (contact angle 90.3 掳~ 4.2 掳) on copper was proposed. By using the improved anodic oxidation electrochemical deposition technique, the growth degree and density of copper hydroxide nanband array on copper foil electrode vary with the height of copper foil by dropping potassium hydroxide solution into the double electrode container of the anodic oxidation system, and the growth degree and density of copper nano-strip array on copper foil electrode vary with the height of copper foil. Thus, the wettability gradient is formed. The wettability gradient copper surface prepared has the characteristic of heat resistance and water resistance. When the copper surface is placed in water bath at 100 鈩，
本文编号：2470610
[Abstract]:A simple method for preparing gradient wetting surface (contact angle 90.3 掳~ 4.2 掳) on copper was proposed. By using the improved anodic oxidation electrochemical deposition technique, the growth degree and density of copper hydroxide nanband array on copper foil electrode vary with the height of copper foil by dropping potassium hydroxide solution into the double electrode container of the anodic oxidation system, and the growth degree and density of copper nano-strip array on copper foil electrode vary with the height of copper foil. Thus, the wettability gradient is formed. The wettability gradient copper surface prepared has the characteristic of heat resistance and water resistance. When the copper surface is placed in water bath at 100 鈩，
本文编号：2470610
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