集成电路制造中Contact Process造成SRAM失效分析与解决

发布时间：2018-01-11 06:28

本文关键词：集成电路制造中Contact Process造成SRAM失效分析与解决　出处：《上海交通大学》2013年硕士论文　论文类型：学位论文

【摘要】：本篇论文的主题是论述了在先进大规模集成电路制造中,相关于Contact制造工艺,对SRAM(静态存储器)成品率提高问题的实际案例分析和解决方法。众所周知,随着集成电路制造中器件的关键尺寸变的越来越小,现代电子产品对于功耗的要求也变的越来越严格,低功耗,高性能,低成本已经成为了绝对的发展趋势。半导体产品的良率对于集成电路制造来说一直是非常重要的衡量指标。它标志着生产工艺的成熟度与制程的稳定性。SRAM(静态存储器)对于集成电路,特别是超大规模的集成电路设计来说,是一个很重要的组成部分,它的器件在一个完整的功能芯片中往往关键尺寸是最小的。这样一来它对于在制造过程中的发生的各种微小的制程差异都有着非常高的灵敏度,由于这种特性,在集成电路制造中SRAM就成为了提高集成度的一个重要的瓶颈。在集成电路制造过程中很多失效都能够在SRAM区域中被发现。对于90纳米以及以下的先进工艺,Contact制程的优劣与稳定与否是造成SRAM失效,影响良率的最主要原因,一直困扰着集成电路设计和制造的发展。集成电路制造过程中的产品良率同时也是决定产品是否可以量产进入市场的一个关键性的因素。如果良率太低不仅会直接影响产品本身的稳定性,而且也会大大增加产品的成本,转而威胁到产品的竞争力。所以如何提升产品的良率,已经是当今集成电路制造业中一项重要的议题。
[Abstract]:The theme of this paper is to discuss the Contact manufacturing process in the advanced large-scale integrated circuit manufacturing. As we all know, the key size of SRAM (static memory) device becomes smaller and smaller with the development of SRAM (static memory). Modern electronic products for power requirements have become more and more stringent, low power consumption, high performance. Low cost has become an absolute trend of development. The yield of semiconductor products has always been a very important measure of integrated circuit manufacturing. It marks the maturity of the production process and the stability of the process. SRA. M (. Static memory) for integrated circuits. Especially for VLSI design, it is a very important component. Its devices are often the least critical size in a complete functional chip, so it has a very high sensitivity to all kinds of small process differences occurring in the manufacturing process, because of this characteristic. In IC manufacturing, SRAM has become an important bottleneck to improve integration. Many failures can be found in the SRAM region during IC manufacturing. For 90 nanometers and below, Advanced technology. The quality and stability of Contact process is the main cause of SRAM failure and affects the yield of SRAM. It has been puzzling the development of IC design and manufacture. At the same time, the product yield is also a key factor to determine whether the product can be mass produced into the market. If the yield is too low, it will not only directly affect the stability of the product itself. Moreover, it will greatly increase the cost of the product and threaten the competitiveness of the product. Therefore, how to improve the yield of the product has become an important issue in the integrated circuit manufacturing industry.
【学位授予单位】：上海交通大学
【学位级别】：硕士
【学位授予年份】：2013
【分类号】：TN405;TP333

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