面向手机应用的TFT-LCD驱动芯片版图设计

发布时间：2018-01-11 14:22

本文关键词：面向手机应用的TFT-LCD驱动芯片版图设计　出处：《天津大学》2013年硕士论文　论文类型：学位论文

【摘要】：随着移动互联网时代的到来，，智能手机正深刻地影响和改变着人们的生活和工作的各个领域。作为用户的主要互动接口，720P高清TFT-LCD(Thin FilmTransistor-Liquid Crystal Display)屏幕已经成为了手机市场的主导显示终端，而TFT-LCD驱动控制芯片作为手机处理器与手机显示屏幕之间的接口电路，其性能将直接影响显示画面的质量和系统功耗。为了适应手持移动设备轻薄短小的产品需求，微型化、低功耗、高集成度、高色彩分辨率以及低成本设计是中小尺寸高清TFT-LCD驱动IC的版图设计的主要挑战。本论文从分析驱动IC版图设计难点着手，结合生产工艺和芯片封装的特点，设计并实现了一个能适应于720P以上的高清TFT-LCD驱动芯片SSL0510的版图设计，具体采取的措施如下：在制造工艺上采用具有5个阱的混合信号CMOS工艺来提高单芯片的集成度和减少芯片的功耗；通过合理的版图布局、允许普通器件直接放置在PAD下方和其它节省面积的设计技巧来缩减芯片尺寸降低成本；采用COG封装、3层Stagger PAD和Fine Pitch的版图设计方法来实现高色彩分辨率的输出；为保证芯片的可靠性和稳定性，还将可制造性设计技术DFM(Design For Manufacture)，信号完整性分析SI(Signal Integrity)，以及天线效应和闩锁预防(Latch-up)加入到了版图设计之中，在保证了版图设计质量的同时兼顾到了芯片设计最小尺寸的考虑。本设计采用了110nm四层金属一层POLY的CMOS混合电压、混合信号工艺，可以驱动高清晰度的非晶硅(a-Si: amorphous silicon) TFT-LCD面板，最高支持720RGB*1280的分辨率，可以达到16.7M色全彩显示，集成了2160个SOURCE驱动信号和1280个GATE时序控制信号，以及电源电路和TCON(Timer ControlRegister)时序控制器。测试表明本设计达到了国际市场同类先进产品的性能。
[Abstract]:With the advent of the mobile Internet era, smart phones are profoundly affecting and changing the lives and work of people in all fields, as the main interface for users. 720P HD TFT-LCD(Thin FilmTransistor-Liquid Crystal display. The screen has become the dominant display terminal in the mobile phone market. As the interface circuit between the mobile phone processor and the display screen, the performance of the TFT-LCD driver control chip will directly affect the quality of the display screen and the power consumption of the system. In order to meet the demand of handheld mobile devices, miniaturization, low power consumption and high integration. High color resolution and low cost design are the main challenges in layout design of medium and small size HD TFT-LCD driver IC. This paper begins with the analysis of the difficulties of driving IC layout design, combining the characteristics of production process and chip packaging. This paper designs and implements the layout design of a high-definition TFT-LCD driver chip SSL0510, which can be applied to 720P or more. The specific measures are as follows: In the manufacturing process, a mixed signal CMOS process with five wells is adopted to improve the integration level of a single chip and reduce the power consumption of the chip. Through a reasonable layout, common devices are allowed to be placed directly under the PAD and other area-saving design techniques to reduce the chip size and reduce the cost; The layout design method of COG encapsulated Stagger PAD and Fine Pitch is adopted to realize the output of high color resolution. In order to ensure the reliability and stability of the chip, the manufacturability design technology DFM(Design For is also introduced. Signal Integrity Analysis (SI(Signal Integrity), as well as antenna effect and latch-up, are added to the layout design. Not only the quality of layout design is guaranteed, but also the minimum size of chip design is considered. This design adopts 110nm four-layer metal one layer POLY CMOS mixed voltage, mixed signal technology. Can drive high-definition amorphous silicon a-Si: amorphous silicon TFT-LCD panel, up to 720RGB / 1280 resolution. It can achieve 16.7 M color full-color display and integrate 2160 SOURCE driver signals and 1280 GATE timing control signals. The test results show that the design achieves the performance of similar advanced products in the international market.
【学位授予单位】：天津大学
【学位级别】：硕士
【学位授予年份】：2013
【分类号】：TN402;TP334.7

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