FDM 3D打印机半导体制冷温控设计及其冷却实验研究

发布时间：2018-06-25 02:21

  本文选题：半导体制冷 + 熔融沉积　； 参考：《机电工程》2016年02期

【摘要】：针对熔融沉积(fused deposition modeling,FDM)3D打印过程中打印大斜率小截面结构时,因散热不良引起的层错位和坍塌问题,对传统FDM 3D打印机PID温度控制方案中存在的问题进行了分析,将半导体制冷技术应用于3D打印过程温度控制之中,设计开发了一种功率可调型半导体制冷系统,对不同散热条件下发生层错位和坍塌问题的角度范围进行了测量和对比。研究结果表明,所设计的半导体制冷系统冷端温度最低可达3.1℃,其热端温度可控制在65℃以下,改善了大斜率小截面结构3D打印过程的散热条件;采用该制冷系统后打印试样发生层错位和坍塌的角度范围比无散热条件时发生上述问题的角度范围减小了50%以上,比普通风扇冷却条件下发生上述问题的角度范围减小了25%以上。
[Abstract]:In order to solve the problem of layer dislocation and collapse caused by poor heat dissipation in the process of printing large slope and small section structure in 3D printing process of fused deposition (fused deposition, the problems in pid temperature control scheme of traditional 3D printer are analyzed. The semiconductor refrigeration technology is applied to the temperature control of 3D printing process. A kind of power adjustable semiconductor refrigeration system is designed and developed. The angle range of layer dislocation and collapse under different heat dissipation conditions is measured and compared. The results show that the cold end temperature of the designed semiconductor refrigeration system can be as low as 3.1 鈩，

本文编号：2064087