基于AMD新一代APU的系统平台开发验证

发布时间：2018-07-09 22:38

本文选题：AMD + APU　；参考：《复旦大学》2012年硕士论文

【摘要】：本文是针对AMD的新一代APU(将GPU集成进CPU)进行桌面应用平台设计,所使用的APU是Trinity家族FM2系列。应用平台命名为Annapurna,是一款典型的ATX桌面机系统平台,其上使用的FCH,传统名称为“南桥”,名为HudsonD4版本为A12。作为一个工程项目,从最初的计划,市场需求反馈,然后产品定义,设计规范,到原理图实现,Layout实现,再到工板的单板调试及Debug,测试、验证。当然最终目的是推广到市场,完成一个完整的项目。本文的主要工作是原理图实现,单板调试／测试,解BUG。原理图方面主要涉及：选取CHIL8338和CHIL8115电源芯片作为APU电源模块；采用了Intersil的ISL6539DC/DC转换器解决了Memory供电问题；选用ANPEC的APL5920KA线性稳压源作为FCH核心电源1.1V的解决方案；用TI的SN75DP126芯片解决DP和HDMI显示输出切换的问题；用肖特基管解决接口的ESD保护问题；网络和音频部分主要解决了数模混合设计中的重点-数模分离问题等。单板调试及解BUG主要涉及：根据电容充放电原理,降低滤波电容容值可以减小上升时间,所以更改电容设计值来解决RSMRST#时序异常BUG；更改Layout设计解决了ESATA功能异常BUG等。测试部分主要涉及基本功能测试和GPU性能测试,同时验证平台设计和APU性能。本文在设计时提出供电部分合“多”为一的方案来解决GPU和CPU合二而一(APU)所带来的电源部分的变化,既要给CPU部分供电,又要给GPU部分供电,所以选用CHIL8338PWM控制器配合门驱动器和MOSFET组来分别输出6组电源来提供电压和电流,同时由于该集成芯片支持AMD SIV2技术,便于APU集中控制来满足上电时序。在显示部分,设计时将不同接口连接到APU的3个专用的显示控制器来解决支持AMD的多显示器技术以及不同标准接口VGA,DVI和DP/HDMI的问题,并使用TI的SN75DP126芯片方案来解决DP/HDMI热插拔时的切换问题。目前为止,Annapurna平台在Validation过程中共发现并解决1096个BUG,PCB已经更新到第四版,整体平台更是高达第26版。设计方案被华硕,微星和联想所采用,预计在6月份推出各品牌的主板。同时验证了Trinity FM2Silicon的功能和性能,改版多次,从AOA, AOB到BOA/B, COA/B/C,现在版本为D0,即将推向终端市场。
[Abstract]:This paper designs a desktop application platform for AMD's new generation APU (integrating GPU into CPU). The APU used is Trinity family FM2 series. Named Annapurna, the application platform is a typical ATX desktop system platform, on which the traditional name is "South Bridge" and the Hudson D 4 version is A12. As an engineering project, from initial planning, market demand feedback, then product definition, design specification, schematic implementation to layout implementation, then to panel debugging and Debug, testing, validation. Of course, the ultimate goal is to market, complete a complete project. The main work of this paper is schematic implementation, single board debugging / testing, solution Bug. The schematic diagram mainly involves: selecting CHIL8338 and CHIL8115 power chip as APU power module, adopting Intersil ISL6539 DC / DC converter to solve memory power supply problem, choosing ANPEC APL5920KA linear stabilized voltage source as the solution of FCH core power supply 1.1 V, using ISL6539 DC / DC converter of Intersil to solve the problem of memory power supply, and selecting ANPEC APL5920KA linear stabilized voltage source as the solution of FCH core power supply. Using TI's SN75DP126 chip to solve the problem of DP and HDMI display output switching, using Schottky transistor to solve the ESD protection problem of interface, the network and audio part mainly solve the problem of digital-analog separation in the mixed design of digital and analog. According to the principle of capacitive charge and discharge, reducing the capacitance value of filter can reduce the rise time, so changing the design value of capacitance to solve the abnormal time sequence bug of RSMRST#, changing layout design to solve the ESATA functional abnormal bug and so on. The testing part mainly involves basic function test and GPU performance test, and also verifies platform design and APU performance. In this paper, the scheme of "more" power supply is put forward to solve the change of power supply caused by the combination of GPU and CPU (APU), which not only supplies power to CPU part, but also provides power supply to GPU part. Therefore, CHIL8338PWM controller is selected to supply voltage and current with gate driver and MOSFET respectively, and the integrated chip supports AMD SIV2 technology, which is convenient for APU centralized control to meet the power sequence. In the display part, three special display controllers are designed to connect different interfaces to APU to solve the problems of supporting AMD's multi-display technology and different standard interfaces, such as VGADVI and DPP-HDMI. TI's SN75 DP126 chip scheme is used to solve the switching problem of DP- / HDMI hot-plug. So far, the Annapurna platform has found and resolved a total of 1096 buggie PCBs in the validation process, and the overall platform is up to version 26. The design, adopted by Asus, Microstar and Lenovo, is expected to launch its brand motherboards in June. At the same time, the function and performance of Trinity FM2Silicon have been verified, which has been revised many times, from AOAA, AOB to BOAP B, COA / R / B / C, now D0, and is about to be introduced to the terminal market.
【学位授予单位】：复旦大学
【学位级别】：硕士
【学位授予年份】：2012
【分类号】：TP368.1

【参考文献】