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某高密度数据机房解决方案浅析

发布时间:2018-07-20 13:38
【摘要】:针对数据机房密度越来越高的发展趋势,提出了水冷背板的散热解决方案。以某高密度数据机房(单机柜密度高达35kW)项目为例,从初投资、占地面积、电耗效率、能耗等方面,与常用的行间制冷方案进行了详细的对比分析,得出了水冷背板散热解决方案具有明显优势的结论,并展望了水冷背板散热方案的应用前景。
[Abstract]:In view of the increasing density of the data computer room, the heat dissipation solution of the water-cooled backplane is put forward. Taking the project of a high density data room (single cabinet density as high as 35kW) as an example, this paper makes a detailed comparison and analysis with common interline refrigeration schemes from the aspects of initial investment, occupation area, power consumption efficiency, energy consumption, etc. The conclusion that the solution of water-cooled backboard has obvious advantages is obtained, and the application prospect of water-cooled backboard heat dissipation scheme is prospected.
【作者单位】: 华为技术有限公司;
【分类号】:TP308


本文编号:2133721

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