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基于相邻多层冗余共享的三维存储器堆叠方法

发布时间:2018-07-21 08:51
【摘要】:为提高三维存储器的成品率和减少冗余行列所需的TSVs的数量,提出每一层存储块都与相邻上下两层共享冗余的三维存储器冗余共享结构,并给出了一种新的堆叠方案,将故障较多与较少的芯片交替堆叠.实验结果表明,该结构在有效控制TSVs数量增长的前提下,提高了三维存储器的修复率.
[Abstract]:In order to improve the yield of 3D memory and reduce the number of TSVs needed for redundant columns, a redundant sharing structure of 3D memory is proposed in which each layer of storage blocks share redundancy with adjacent upper and lower layers, and a new stacking scheme is proposed. Alternately stack more faults with fewer chips. The experimental results show that the proposed structure can effectively control the growth of TSVs and improve the repair rate of 3D memory.
【作者单位】: 合肥工业大学计算机与信息学院;情感计算与先进智能机器安徽省重点实验室;日本德岛大学先端技术科学教育部;
【基金】:国家自然科学基金资助项目(61306049;61204046;61432004;61474035)
【分类号】:TP333


本文编号:2134992

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