软件工程基于剖面映射的软硬件可靠性综合试验方法研究

发布时间：2018-08-29 20:14

【摘要】：为真实反映产品的实际使用情况,准确验证软硬件综合系统的可靠性,将软件可靠性测试以及硬件可靠性试验进行了综合,提出一种基于剖面映射的软硬件可靠性综合试验方法.该方法首先确定软件测试剖面以及综合环境应力剖面,然后利用剖面映射将软件测试剖面与综合环境应力剖面结合起来,形成软硬件可靠性综合试验剖面;该综合试验剖面真实反映了软件运行和外部环境条件变化之间的关联,避免了软件可靠性测试和硬件可靠性试验分别进行所带来的试验风险和资源浪费,在减少测试代价的同时实现了一次试验即验证产品的可靠性.实验结果表明了该方法的可行性、合理性和有效性.
[Abstract]:In order to truly reflect the actual use of the product and verify the reliability of the software and hardware integrated system, the software reliability test and the hardware reliability test are synthesized. A comprehensive test method of software and hardware reliability based on profile mapping is proposed. In this method, the software test section and the comprehensive environmental stress profile are first determined, and then the software test section and the comprehensive environmental stress section are combined by using the profile mapping to form the software and hardware reliability comprehensive test profile. The comprehensive test profile truly reflects the relationship between software operation and changes in external environmental conditions, and avoids the risk of testing and waste of resources brought by software reliability testing and hardware reliability testing, respectively. At the same time, the test cost is reduced and the reliability of the product is verified by one test. The experimental results show that the method is feasible, reasonable and effective.
【作者单位】：中国航空综合技术研究所;
【基金】：科工局课题([2012]1481)
【分类号】：TP306

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