基于ARM11的板级支持包的设计与实现
发布时间：2018-12-18 12:15
【摘要】：随着嵌入式技术的不断发展，嵌入式系统被应用到了社会的各个领域。加载和引导操作系统内核、开发相关设备驱动、固化软件等是嵌入式系统开发的首要任务。板级支持包(Board Support Package，简称BSP)，是位于嵌入式操作系统和硬件之间的一层软件，它的主要任务是初始化硬件环境，引导和加载嵌入式操作系统，为嵌入式系统软件的开发提供调试支持。 以基于ARM11的硬件平台为基础，设计了能够引导Windows CE操作系统和为系统开发提供调试支持的板级支持包。将板级支持包划分为引导模块、操作系统硬件抽象层模块、相关设备驱动模块和扩展模块四部分。引导模块实现系统的初始化和操作系统的加载和引导；操作系统硬件抽象层模块实现操作系统定义的底层硬件接口，为操作系统运行提供支持；相关设备驱动模块完成操作硬件设备和向BSP提供简单操作接口；扩展功能模块完成板级支持包基本功能外的具体功能需求。 引导模块中，完成了系统上电后的板级初始化，实现了Windows CE的加载和引导。操作系统硬件抽象层实现了中断处理、时钟操作、CPU状态管理三个模块的接口函数。驱动模块实现了USB驱动和SD卡驱动。扩展功能模块中，设计了宿主机和目标机之间的通信协议，，实现了基于USB协议的软件固化；分析了SD卡的启动原理，实现了SD卡方式的软件固化；为了提高用户体验，实现了开机画面的固化和加载显示。
[Abstract]:With the development of embedded technology, embedded system has been applied to every field of society. Loading and booting operating system kernel, developing device driver and solidifying software are the most important tasks of embedded system development. Board level support package (Board Support Package,) is a layer of software located between embedded operating system and hardware. Its main task is to initialize hardware environment, boot and load embedded operating system. It provides debugging support for the development of embedded system software. Based on the hardware platform based on ARM11, a board support package is designed to boot the Windows CE operating system and provide debugging support for system development. The board support package is divided into four parts: boot module, operating system hardware abstract layer module, related device driver module and extension module. The bootstrap module realizes the initialization of the system and the loading and booting of the operating system, and the hardware abstraction layer module of the operating system realizes the underlying hardware interface defined by the operating system, which provides support for the operation of the operating system. The related device driver module completes the operation of the hardware device and provides a simple operation interface to the BSP, and the extended function module completes the specific functional requirements beyond the basic functions of the board level support package. In the boot module, the board initialization is completed after the system is powered on, and the loading and booting of Windows CE is realized. The interface functions of interrupt processing, clock operation and CPU state management are implemented in the abstract layer of operating system hardware. The driver module realizes USB driver and SD card driver. In the extended function module, the communication protocol between host computer and target computer is designed, and the software solidification based on USB protocol is realized, and the principle of SD card startup is analyzed, and the software solidification of SD card mode is realized. In order to improve the user experience, the solidification and loading display of the boot screen are realized.
【学位授予单位】：华中科技大学
【学位级别】：硕士
【学位授予年份】：2012
【分类号】：TP368.1
本文编号：2385833
[Abstract]:With the development of embedded technology, embedded system has been applied to every field of society. Loading and booting operating system kernel, developing device driver and solidifying software are the most important tasks of embedded system development. Board level support package (Board Support Package,) is a layer of software located between embedded operating system and hardware. Its main task is to initialize hardware environment, boot and load embedded operating system. It provides debugging support for the development of embedded system software. Based on the hardware platform based on ARM11, a board support package is designed to boot the Windows CE operating system and provide debugging support for system development. The board support package is divided into four parts: boot module, operating system hardware abstract layer module, related device driver module and extension module. The bootstrap module realizes the initialization of the system and the loading and booting of the operating system, and the hardware abstraction layer module of the operating system realizes the underlying hardware interface defined by the operating system, which provides support for the operation of the operating system. The related device driver module completes the operation of the hardware device and provides a simple operation interface to the BSP, and the extended function module completes the specific functional requirements beyond the basic functions of the board level support package. In the boot module, the board initialization is completed after the system is powered on, and the loading and booting of Windows CE is realized. The interface functions of interrupt processing, clock operation and CPU state management are implemented in the abstract layer of operating system hardware. The driver module realizes USB driver and SD card driver. In the extended function module, the communication protocol between host computer and target computer is designed, and the software solidification based on USB protocol is realized, and the principle of SD card startup is analyzed, and the software solidification of SD card mode is realized. In order to improve the user experience, the solidification and loading display of the boot screen are realized.
【学位授予单位】：华中科技大学
【学位级别】：硕士
【学位授予年份】：2012
【分类号】：TP368.1
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本文编号：2385833
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