压电式喷墨打印头腔室的制作工艺研究
发布时间：2019-05-07 18:30
【摘要】：压电式喷墨打印技术以其经济、耐用、高效、分辨率高等优点得到广泛的应用。该项技术已经向微电子制造、微型光学元件制作、微电子封装等其他工业领域发展。同时这种技术的喷射材料也不止局限于墨水现在也可以用于银浆、光刻胶等的喷射。这项技术现在被国外垄断,因此国内很多学者也在进行这方面的研究。现在喷墨腔室的制作方法主要有牺牲层法和键合法,但是由于喷墨腔室的内部尺寸较小,牺牲层材料不易排出。现有的键合法是在盖板上做好结构然后进行键合,增加了键合难度和成本。本文利用改进的直接热键合法制作出了低成本的腔室。主要研究内容如下：(1)提出了一种改进的直接热键合方法,可以有效的解决在键合过程中凹陷问题。首先利用MEMS工艺中的光刻工艺制得开放的喷墨腔室结构,然后键合一层厚度约10μm的SU-8胶膜,完成光刻后再旋涂一层SU-8胶完成键合。同时分析了键合压力、键合时间和键合温度对键合率和键合强度的影响。与其他键合方法相比键合过程中不易出现凹陷,键合率和键合强度比较高,可以为制作低成本高键合强度微通道提供一种新的工艺方法。(2)使用氧等离子体处理喷墨腔室表面提高SU-8胶的表面能提高键合强度。固化的SU-8胶的表面能很低键合层在显影时很容易起胶。用氧等离子体处理SU-8胶表面后能够增加其表面的浸润性增强键合强度。同时设计了通过气压控制键合压力大小的键合夹具,增大了键合过程中的施力面积,因此利用这个夹具可以对整个键合面施加均匀的键合压力,使键合率和键合强度有了很大的改善。(3)研究了影响喷墨孔通孔率的因素。本文中的基底表面比较复杂,曝光的过程中在基底发生漫反射,反射光会使喷墨孔位置的SU-8胶曝光,影响喷墨孔的通孔率。通过实验分析防反射材料AZBaril-Ⅱ可以把入射光全部吸收消除反射光的影响,在基底应用防反射材料AZBaril-Ⅱ使通孔率有了一定的提高。同时在键合的过程中因为键合参数的影响会引起键合层的凹陷,在曝光的过程中会在键合层发生全反射使喷墨孔曝光影响通孔率,因此研究了最佳的键合压力、键合时间和键合温度减小了键合层的凹陷,使通孔率达到90%以上。(4)最后,本文用墨滴测试实验平台进行了喷墨测试,验证了压电式喷墨打印头制作工艺的合理性,也为我们的优化以及后期的研究制作提供了帮助。
[Abstract]:Piezoelectric inkjet printing technology has been widely used because of its economic, durable, efficient, high resolution and other advantages. The technology has been developed to other industrial fields such as microelectronics manufacturing, micro-optical component fabrication, microelectronic packaging and so on. At the same time, the spray material of this technology is not limited to ink, but also can be used in the spray of silver paste, photolithography and so on. The technology is now monopolized by foreign countries, so many domestic scholars are also doing this research. At present, the manufacturing methods of inkjet chamber mainly include sacrifice layer method and bond method, but because of the small internal size of the chamber, the material of sacrificial layer is not easy to be discharged. The existing bonding method is to make a good structure on the cover plate and then bond, which increases the bonding difficulty and cost. In this paper, a low cost chamber has been fabricated by an improved direct thermal bonding method. The main contents are as follows: (1) an improved direct thermal bonding method is proposed, which can effectively solve the sag problem in the bonding process. First, an open chamber structure of inkjet chamber was fabricated by MEMS lithography, then a SU-8 film with thickness of about 10 渭 m was bonded to finish the lithography and then a layer of SU-8 adhesive was rotated to finish bonding. At the same time, the effects of bonding pressure, bonding time and bonding temperature on bond rate and bond strength were analyzed. Compared with other bonding methods, the bonding process is not easy to appear depression, and the bond rate and bond strength are relatively high. It can provide a new process method for fabricating low cost and high bonding strength microchannel. (2) the surface of SU- 8 adhesive can be improved by oxygen plasma treatment on the surface of inkjet chamber. The surface of the solidified SU- 8 adhesive is very low bonding layer, which is easy to be glued when it is developed. After the surface of SU-8 adhesive was treated with oxygen plasma, the wettability and bond strength of the adhesive could be increased. At the same time, a bonding fixture controlled by air pressure is designed, which increases the applied force area in the bonding process. Therefore, the uniform bonding pressure can be applied to the whole bonding surface by using the clamp. The bonding rate and bond strength have been greatly improved. (3) the factors affecting the porosity of inkjet holes have been studied. The surface of the substrate in this paper is rather complex. Diffuse reflection occurs on the substrate during exposure. The reflected light will expose the SU- 8 adhesive at the position of the inkjet hole, which will affect the porosity of the ink-jet hole. The experimental results show that the anti-reflection material AZBaril- 鈪，
本文编号：2471302
[Abstract]:Piezoelectric inkjet printing technology has been widely used because of its economic, durable, efficient, high resolution and other advantages. The technology has been developed to other industrial fields such as microelectronics manufacturing, micro-optical component fabrication, microelectronic packaging and so on. At the same time, the spray material of this technology is not limited to ink, but also can be used in the spray of silver paste, photolithography and so on. The technology is now monopolized by foreign countries, so many domestic scholars are also doing this research. At present, the manufacturing methods of inkjet chamber mainly include sacrifice layer method and bond method, but because of the small internal size of the chamber, the material of sacrificial layer is not easy to be discharged. The existing bonding method is to make a good structure on the cover plate and then bond, which increases the bonding difficulty and cost. In this paper, a low cost chamber has been fabricated by an improved direct thermal bonding method. The main contents are as follows: (1) an improved direct thermal bonding method is proposed, which can effectively solve the sag problem in the bonding process. First, an open chamber structure of inkjet chamber was fabricated by MEMS lithography, then a SU-8 film with thickness of about 10 渭 m was bonded to finish the lithography and then a layer of SU-8 adhesive was rotated to finish bonding. At the same time, the effects of bonding pressure, bonding time and bonding temperature on bond rate and bond strength were analyzed. Compared with other bonding methods, the bonding process is not easy to appear depression, and the bond rate and bond strength are relatively high. It can provide a new process method for fabricating low cost and high bonding strength microchannel. (2) the surface of SU- 8 adhesive can be improved by oxygen plasma treatment on the surface of inkjet chamber. The surface of the solidified SU- 8 adhesive is very low bonding layer, which is easy to be glued when it is developed. After the surface of SU-8 adhesive was treated with oxygen plasma, the wettability and bond strength of the adhesive could be increased. At the same time, a bonding fixture controlled by air pressure is designed, which increases the applied force area in the bonding process. Therefore, the uniform bonding pressure can be applied to the whole bonding surface by using the clamp. The bonding rate and bond strength have been greatly improved. (3) the factors affecting the porosity of inkjet holes have been studied. The surface of the substrate in this paper is rather complex. Diffuse reflection occurs on the substrate during exposure. The reflected light will expose the SU- 8 adhesive at the position of the inkjet hole, which will affect the porosity of the ink-jet hole. The experimental results show that the anti-reflection material AZBaril- 鈪，
本文编号：2471302
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