微谐振器纵向振动热弹性耦合分析

发布时间：2018-01-16 06:24

本文关键词：微谐振器纵向振动热弹性耦合分析　出处：《北京理工大学学报》2016年12期 　论文类型：期刊论文

【摘要】：对微谐振器在纵向振动时的热弹性耦合进行分析,以悬臂梁为基础,在环境温度为300K时,对热弹性本构方程进行数值求解,对在纵向振动过程中产生的温度、受热弹性耦合的影响产生的频率漂移、热弹性阻尼进行分析.分析结果发现,在纵向振动过程中,悬臂梁在前3阶振动模态下,温度变化量随着振动模态的升高而增大,在3阶振动模态时,温度变化量约为1.5K;受热弹性耦合影响,频率漂移比首先随着梁长的增加而迅速增加,然后稳定在1.67×10-4附近;热弹性阻尼最大值约为1.0×10-4.然后,使用COMSOL Multiphysics软件对悬臂梁进行热弹性耦合仿真,并对数值结果进行验证.结果表明,仿真结果与理论计算结果相吻合.
[Abstract]:The thermoelastic coupling of microresonator in longitudinal vibration is analyzed. Based on the cantilever beam, the thermoelastic constitutive equation is solved numerically at ambient temperature of 300K. The temperature produced during longitudinal vibration and the frequency drift and thermoelastic damping caused by thermoelastic coupling are analyzed. The results show that in the process of longitudinal vibration. The temperature variation of the cantilever beam increases with the increase of the vibration mode in the first three vibration modes, and the temperature change is about 1.5 K in the third order vibration mode. Under the influence of thermoelastic coupling, the frequency drift ratio increases rapidly with the increase of beam length, and then stabilizes around 1.67 脳 10 ~ (-4). The maximum value of thermoelastic damping is about 1.0 脳 10 ~ (-4). Then, the thermoelastic coupling simulation of cantilever beam is carried out by using COMSOL Multiphysics software. The numerical results are verified and the results show that the simulation results are in good agreement with the theoretical results.
【作者单位】：北京理工大学爆炸科学与技术国家重点实验室;
【基金】：国家“八六三”计划项目(2013AA041104)
【分类号】：O32
【正文快照】： 在MEMS领域,设计具有高品质因子或低能量损耗的谐振器是设计MEMS器件的关键因素.在微机械能量损失机制中存在外部能量损耗与内部能量损耗两种主要形式.外部能量损耗如空气阻尼,是由于在非真空环境中,周围环境气体与器件相互作用而导致的能量损失[1].内部能量损耗包括晶格缺陷

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