基于3D打印技术的电子电路和梯度模型的成型工艺研究

发布时间：2018-03-20 12:20

本文选题：3D打印　切入点：电子电路　出处：《华中科技大学》2016年硕士论文　论文类型：学位论文

【摘要】：将3D打印技术和印刷电子技术结合是本文研究的重点,着重研究在柔性基底上成型电子电路。另外通过对FDM同材料梯度模型打印进行研究,探讨梯度材料打印的可行性。本文的主要研究内容包括:(一)针对单层电路打印,本文通过自主搭建电子电路3D打印机,可在柔性或者硬质基底上打印电子电路。随着重写次数的增加,电路的宽度和厚度会不断的增加,而其电阻率特性却没有多大的影响。通过对比PET膜、纸、橡胶和PDMS等四种不同基底,测量其接触角的变化,优先选择粘附性较好的PET膜和纸。同时,探究电子电路的最小打印宽度,并对电路的折弯性能进行了测试,实验获得比较理想的效果。(二)针对双层电路打印,本文自主搭建了具有聚乳酸PLA打印和导电银浆打印的双喷头系统,使得电子电路的打印更加多样化。为避免双层打印中不平整的因素,本文采用方波型路径的设置,使得喷头在交叉点处可以相对绝缘层而上升一段距离并在其表面打印电路。同时,本文还对双层电路之间的绝缘性能进行了研究。(三)针对斜面电路打印,该项技术能够很好的体现3D打印的特点。本文自主设计并搭建了能够在斜面打印的可升降式喷头结构,集成在Speedymaker2.0原型机上。同时,对斜面打印的工艺特点进行了分析,并测试了在斜面上成功打印的电路,均得到良好的实验结果。(四)针对FDM同种材料梯度打印进行研究,搭建双喷头打印的硬件系统。其中,对双喷头打印中存在的漏液问题进行了三个方面的探讨,并得出以下结论,一是改变回抽量和回抽速度,使得融道内部形成一定的真空度。二是使用外角度更大的尖喷嘴能够使得喷嘴出口处的温度更低,使得聚乳酸的粘性更大。三是增加喷嘴挤出口段的阻力。
[Abstract]:The combination of 3D printing technology and printing electronics technology is the focus of this paper, focusing on the study of forming electronic circuits on flexible substrates. In addition, through the study of FDM with material gradient model printing, The main research contents of this paper include: (1) aiming at single-layer circuit printing, this paper builds an electronic circuit 3D printer independently. Electronic circuits can be printed on flexible or hard substrates. As the number of rewrites increases, the width and thickness of the circuits increase without much effect on their resistivity. By comparing PET films, paper, Four different substrates, rubber and PDMS, were used to measure the change of contact angle, and the PET film and paper with better adhesion were preferred. At the same time, the minimum print width of the electronic circuit was explored, and the bending performance of the circuit was tested. In this paper, a dual sprinkler system with polylactic acid PLA printing and conductive silver paste printing is built. In order to avoid the uneven factors in double-layer printing, the square wave path is used in this paper. At the intersection point, the nozzle can rise a distance relative to the insulation layer and print the circuit on its surface. At the same time, the insulation performance of the double-layer circuit is studied in this paper. (3) for the inclined circuit printing, This technology can well reflect the characteristics of 3D printing. This paper designs and builds the lifting nozzle structure which can print on the sloping plane, and integrates it on the Speedymaker2.0 prototype machine. At the same time, the process characteristics of the sloping plane printing are analyzed. The circuit successfully printed on the sloping plane is tested, and good experimental results are obtained. (4) the research on gradient printing of the same material for FDM is carried out, and the hardware system of double-nozzle printing is built. In this paper, the leakage problem in double nozzle printing is discussed in three aspects, and the following conclusions are drawn: one is to change the amount and speed of backdraft, The second is that the temperature at the nozzle outlet is lower, and the viscosity of polylactic acid is higher. Third, the resistance of extruding nozzle is increased.
【学位授予单位】：华中科技大学
【学位级别】：硕士
【学位授予年份】：2016
【分类号】：TP391.73;TN41

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