超声空化对软性磨粒流切削效率和质量的影响

发布时间：2018-12-18 00:24

【摘要】：为提高软性磨粒流切削的效能,研究了利用超声空化作用加快材料去除的方法。在分析磨粒抛光试验和计算流体动力学仿真结果的基础上,提出并验证磨粒碰撞壁面的动能是影响切削效率主要因素的假设;根据对超声空化气泡溃灭,及其在外围水域中冲击波形成与传播的研究结果,分析气泡溃灭在推动磨粒改变其动能时所起的增强湍流效果的作用。在此基础上搭建了超声辅助磨粒流试验装置,以表面覆有氧化层的硅片为试验对象,根据其表面氧化层的去除情况,分析超声空化对硅片表面材料去除能力的影响,并在磨粒流加工无氧化层硅片表面的试验中,观察到超声空化对磨粒流切削的显著影响。验证了超声空化能使磨粒流中的磨粒的动能发生改变,从而起到提高切削效率和提高表面质量的作用,以期为超声波作用下磨粒流加工工艺的改进提供参考。
[Abstract]:In order to improve the efficiency of soft abrasive cutting, the method of accelerating material removal by ultrasonic cavitation was studied. Based on the analysis of abrasive polishing test and computational fluid dynamics simulation results, the hypothesis that the kinetic energy of abrasive particle collision wall is the main factor affecting cutting efficiency is proposed and verified. Based on the results of ultrasonic cavitation bubble collapse and the formation and propagation of shock waves in the surrounding waters, the effect of bubble collapse on enhancing turbulent flow when abrasive particles change their kinetic energy is analyzed. On the basis of this, an ultrasonic assisted abrasive particle flow test device was set up. The effect of ultrasonic cavitation on the removal ability of surface materials of silicon wafer was analyzed according to the removal of oxide layer on the surface of silicon wafer. The effect of ultrasonic cavitation on abrasive flow cutting was observed in the experiments of abrasive flow machining of non-oxidized silicon wafers. It is verified that ultrasonic cavitation can change the kinetic energy of abrasive particles in abrasive flow, which can improve the cutting efficiency and surface quality.
【作者单位】：浙江工业大学机械工程学院;丽水学院浙江省特色文创产品数字化设计与智能制造重点实验室;
【基金】：国家自然科学基金资助项目(51575494;51375446) 浙江省自然科学基金重点项目(LZ14E050001) 浙江省杰出青年科学基金项目(LR16E050001)
【分类号】：TB559;TG664

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