用于降低接触热阻的复合黏结材料的制备优化

发布时间：2019-05-07 15:54

【摘要】：基于提高吸附床的导热性能,研制一种可涂于吸附床与吸附剂之间降低接触热阻的耐高温耐腐蚀的高导热复合黏结材料。通过稳态试验研究导热填料、稀释剂与偶联剂等因素对复合黏结材料热导率的影响,采用正交试验方法优化复合黏结材料的配制方案。研究结果表明:复合黏结材料的导热性能随着Al_2O_3导热填料的质量分数的增加而提高,采用10μm Al_2O_3导热填料粒子的导热性能略高于采用35μm Al_2O_3导热填料粒子的复合黏结材料,10μm Al_2O_3导热填料粒子用质量分数8%的偶联剂处理,复合黏结材料的热导率最高。采用适当配比的导热填料、稀释剂与偶联剂能显著提高复合黏结材料的热导率。
[Abstract]:In order to improve the thermal conductivity of the adsorption bed, a high temperature and corrosion resistant composite bonding material with high temperature and corrosion resistance was developed, which can be coated between the adsorption bed and the adsorbent to reduce the contact thermal resistance. The effects of heat conduction filler, diluent and coupling agent on the thermal conductivity of composite bonding materials were studied by steady-state test. The orthogonal test method was used to optimize the preparation scheme of composite bonding materials. The results show that the thermal conductivity of the composite binder increases with the increase of the mass fraction of Al_2O_3 filler. The thermal conductivity of 10 渭 m Al_2O_3 filler particle is slightly higher than that of 35 渭 m Al_2O_3 thermal conductive filler particle, and the 10 渭 m Al_2O_3 heat conduction filler particle is treated with 8% coupling agent. The composite bonding material has the highest thermal conductivity. The thermal conductivity of the composite bonded material can be significantly improved by proper proportion of heat conduction filler, diluent and coupling agent.
【作者单位】：山东大学苏州研究院;山东大学能源与动力工程学院;
【基金】：苏州市科技发展计划资助项目(ZXG201443) 国家自然科学基金资助项目(51476093) 山东省科技发展计划资助项目(2013GGX10403)
【分类号】：O551.3;TB34

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