封装系统中的温度压力控制系统设计

发布时间：2018-06-20 10:17

本文选题：温度压力控制 + STM32　；参考：《南京信息工程大学》2017年硕士论文

【摘要】：近年来随着纳米科技的不断进步,纳米材料被运用于半导体行业中,诞生了新的封装工艺,但是在控制领域却少有针对新型材料烧结的控制系统。同时半导体产品在我们的日常生活中越来越不可或缺,甚至在一些关键的位置发挥着举足轻重的作用,半导体器件的品质至关重要。而在生产过程中,最重要的两个因素便是温度和压力。因此,本文提出了一种运用于新型纳米材料封装系统中恒温恒压箱内的温度、压力控制设计。本文完成了封装系统恒温恒压箱内的温度、压力控制系统的硬件、软件设计工作,首先对该课题的研究背景、意义以及对国内外温度、压力智能监控系统的发展状况做了简单的描述,然后对使用ARM的CortexM3内核的STM32控制器设计的温度、压力控制系统做了详细的介绍。在硬件方面,本文对各个模块及功能都做出了理论分析,包括电源电路、采集电路和信号处理电路等等。选用了 STM32F103ZET6作为控制核心。温度传感器采用的是PT1000铂电阻温度传感器,并设计了温度采集、升温、降温驱动电路,实现温度的控制。压力传感器采用了压阻式压力传感器,设计了通过伺服电机和伺服控制器来控制设备内部的气压。软件方面,每个程序模块相互独立,使用C语言完成编写。同时研究了常规PID算法和模糊PID算法并运用于温度、压力控制,实现参数自整定。编写上位机界面,通过人性化的人机界面控制温度、压力,并显示实时温度、压力曲线。最后,进行系统的调试、仿真,先是分别对常规PID算法和模糊PID算法进行了 Matlab仿真,通过仿真结果表明,模糊PID控制算法超调量更小,抗干扰能力强,达到较好的控制效果。再对整个系统进行一系列验证实验,实验结果表明,所设计的温度、压力控制系统满足设计要求。
[Abstract]:In recent years, with the development of nanotechnology, nanomaterials have been used in semiconductor industry, and a new packaging technology has emerged. However, in the field of control, there are few control systems for sintering of new materials. At the same time, semiconductor products are becoming more and more indispensable in our daily life, and even play a pivotal role in some key positions. The quality of semiconductor devices is very important. In the production process, the two most important factors are temperature and pressure. Therefore, this paper presents a design of temperature and pressure control in constant temperature and constant pressure box used in a new type of nanomaterial packaging system. In this paper, the hardware and software design of the temperature and pressure control system in the package system is completed. Firstly, the research background, significance and temperature at home and abroad are given. This paper briefly describes the development of the pressure intelligent monitoring system, and then introduces the temperature and pressure control system of the STM32 controller based on the CortexM3 kernel of arm in detail. In terms of hardware, this paper makes a theoretical analysis of each module and function, including power circuit, acquisition circuit and signal processing circuit and so on. STM32F 103 ZET6 is selected as the control core. The temperature sensor adopts PT1000 platinum resistance temperature sensor, and the temperature acquisition, heating and cooling drive circuit is designed to realize temperature control. The pressure sensor adopts piezoresistive pressure sensor, and the pressure inside the equipment is controlled by servo motor and servo controller. Software, each program module independent of each other, using C language to complete the preparation. At the same time, the conventional pid algorithm and fuzzy pid algorithm are studied and applied to temperature and pressure control to realize parameter self-tuning. Write upper computer interface, control temperature, pressure and display real-time temperature and pressure curve through human-machine interface. Finally, the system is debugged and simulated. Firstly, the conventional pid algorithm and the fuzzy pid algorithm are simulated by Matlab. The simulation results show that the fuzzy pid control algorithm has less overshoot, stronger anti-jamming ability and better control effect. A series of verification experiments are carried out on the whole system. The experimental results show that the designed temperature and pressure control system meets the design requirements.
【学位授予单位】：南京信息工程大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TP273

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