电积法制备泡沫铅研究
发布时间：2018-08-22 10:00
【摘要】：泡沫铅是一种重要的具有三维独特网状结构的泡沫金属材料。其孔隙率高,比表面积大,在电池行业具有广泛的应用前景。本文以聚氨酯泡沫为基体,经脱脂、粗化、导电化、镀铜、镀铅等工艺制备出开孔状结构的泡沫铅金属材料。 首先对聚氨酯泡沫进行有机溶剂脱脂和化学脱脂,然后再进行粗化、除膜,最后涂覆导电胶进行导电化处理。 在聚氨酯泡沫基体上镀铜工艺实验研究中,首先通过霍尔槽实验选择镀铜体系,得出酸性光亮镀液最佳；然后,对酸性镀铜的添加剂进行实验研究,实验发现以NaCl和OP乳化剂为添加剂得到的铜镀层光亮、细致,韧性好；最后探讨了镀液各组分浓度、镀液温度、阴极表观电流密度、异极距、电镀时间等工艺条件对电流效率及槽电压的影响,得到了最佳的镀铜工艺参数,即镀液组成为CuSO4 180g/L、H2SO4 54g/L、NaCl 0.6g/L、OP乳化剂0.4mL/L、异极距为3.5cm、阴极电流密度为3.0A/dm2、镀液温度为25℃、电镀时间为35min。在此优化条件下,电流效率高,槽电压低,且得到的铜镀层光亮性好、韧性好。 镀铜泡沫基体上镀铅工艺实验研究中,主要研究了镀铅体系各组分浓度、阴极电流密度、镀液温度、电镀时间等工艺条件对镀铅过程参数及镀层质量的影响。得到了最佳镀铅工艺参数,即镀液组成为pb2+115g/L、游离HBF445g/L、硼酸浓度饱和、添加剂0.5g/L、阴极表观电流密度为3.0A/dm2、镀液温度为25℃、电镀时间为30-50min。在此优化条件下,电流效率高,槽电压低,且得到的泡沫铅镀层结晶细密、均匀,且韧性和光亮性都较好,孔隙率高,具有三维网状结构。
[Abstract]:Lead foam is an important foamed metal material with three-dimensional unique mesh structure. Because of its high porosity and large specific surface area, it has wide application prospect in battery industry. In this paper, the porous lead foams were prepared by degreasing, coarsening, conducting, copper plating and lead plating with polyurethane foam as the matrix. Polyurethane foam was first degreased by organic solvent and chemical degreasing, then coarsened, removed film, and then coated with conductive adhesive for conducting treatment. In the experimental study of copper plating process on polyurethane foam matrix, firstly, the copper plating system is selected by Hall cell experiment, and the acid bright plating bath is obtained, and then the additive of acid copper plating is studied experimentally. The results show that the copper coating with NaCl and op emulsifiers as additives is bright, meticulous and good in toughness. Finally, the concentration of each component in the bath, bath temperature, cathodic apparent current density, and the distance between different electrodes are discussed. The effect of electroplating time on the current efficiency and cell voltage is obtained. The optimum copper plating parameters are obtained. The bath composition is CuSO4 180g / L _ 2SO _ 4 54g / L ~ (-1) NaCl 0.6g / L ~ (-1) op emulsifier 0.4mL / L ~ (-1), the different pole distance is 3.5cm, the cathode current density is 3.0A / d ~ (2), the bath temperature is 25 鈩，
本文编号：2196763
[Abstract]:Lead foam is an important foamed metal material with three-dimensional unique mesh structure. Because of its high porosity and large specific surface area, it has wide application prospect in battery industry. In this paper, the porous lead foams were prepared by degreasing, coarsening, conducting, copper plating and lead plating with polyurethane foam as the matrix. Polyurethane foam was first degreased by organic solvent and chemical degreasing, then coarsened, removed film, and then coated with conductive adhesive for conducting treatment. In the experimental study of copper plating process on polyurethane foam matrix, firstly, the copper plating system is selected by Hall cell experiment, and the acid bright plating bath is obtained, and then the additive of acid copper plating is studied experimentally. The results show that the copper coating with NaCl and op emulsifiers as additives is bright, meticulous and good in toughness. Finally, the concentration of each component in the bath, bath temperature, cathodic apparent current density, and the distance between different electrodes are discussed. The effect of electroplating time on the current efficiency and cell voltage is obtained. The optimum copper plating parameters are obtained. The bath composition is CuSO4 180g / L _ 2SO _ 4 54g / L ~ (-1) NaCl 0.6g / L ~ (-1) op emulsifier 0.4mL / L ~ (-1), the different pole distance is 3.5cm, the cathode current density is 3.0A / d ~ (2), the bath temperature is 25 鈩，
本文编号：2196763
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