下填充流动的实验研究及二维化数值分析方法的验证

发布时间：2018-02-12 06:03

本文关键词： 倒装芯片实验验证二维化数值分析多边填充　出处：《华东理工大学》2017年硕士论文　论文类型：学位论文

【摘要】：倒装芯片技术由于具有输入/输出容量大、能改善电气性能等优点而被广泛应用于半导体封装行业。下填充是倒装芯片封装中的重要工艺环节,其中又以毛细压驱动的下填充封装工艺最为常见。研究封装材料在下填充过程中的流动行为对实际的下填充封装生产有重要的指导作用。本文通过实验的方法研究了下填充流体的流动行为,重点考察了焊球的大小、间距和布胶方式对流动的影响,并据此验证了二维化数值分析方法的准确性。本文的主要研究内容和结果有以下几个方面:(1)应用光刻技术制作了下填充实验所需要的倒装芯片试样,其中基板和芯片用透明的玻璃片代替,焊球通过刻蚀玻璃片表面的硅得到,三者通过SOG(Silicon on Glass)技术键合在一起,实现了下填充流动过程的可视化。(2)搭建了下填充流动可视化实验平台,通过对13组试样的下填充实验对比,研究了焊球直径、焊球间距以及布胶方式对下填充流动的影响。(3)针对实验案例,应用二维化数值分析方法模拟了下填充流动过程,通过与实验结果比较,验证了二维模拟的准确性,并进一步分析了模拟与实验结果之间的误差。(4)将二维化数值分析方法应用于来自IBM公司的倒装芯片的下填充过程,用下填充实验检验了其准确性,说明了二维化数值分析方法在倒装芯片下填充领域具有较大的实际应用价值。
[Abstract]:Flip-chip technology is widely used in semiconductor packaging industry because of its large input / output capacity and the ability to improve electrical performance. Among them, the capillary pressure driven underfill packaging process is the most common. The study of the flow behavior of packaging materials in the process of underfill packaging has an important guiding role in the actual production of underfilled packaging. The flow behavior of the down-filled fluid is studied. The effects of the size, spacing and glue pattern of the solder ball on the flow were investigated. The accuracy of the two-dimensional numerical analysis method is verified. The main contents and results of this paper are as follows: 1. The substrate and chip are replaced by transparent glass sheets, the solder balls are obtained by etching silicon on the surface of the glass sheets, and the three are bonded together by SOG(Silicon on glass technology. The visualization of the flow process is realized. (2) A visual experimental platform for the flow of the lower filling is built. The diameter of the solder ball is studied by comparing the experiments of 13 groups of samples. The effect of solder ball spacing and glue distribution on the flow of underfill. (3) in view of the experimental cases, the flow process of the lower filling is simulated by using two-dimensional numerical analysis method. The accuracy of the two-dimensional simulation is verified by comparing with the experimental results. Furthermore, the error between simulation and experimental results is analyzed. The two-dimensional numerical analysis method is applied to the underfilling process of the inverted chip from IBM Company. The accuracy of this method is verified by the underfilling experiment. It is shown that the two-dimensional numerical analysis method has great practical application value in the field of filling under the inverted chip.
【学位授予单位】：华东理工大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TN405;O35

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